SuperServer SSG-110P-NTR10 (Complete System Only)

SSG-110P-NTR10 Main SSG-110P-NTR10 Angle SSG-110P-NTR10 Top SSG-110P-NTR10 Front SSG-110P-NTR10 Rear
Integrated Board: X12SPO-NTF
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Key Applications

  • Virtualization
  • Cloud Computing
  • All Flash Storage
  • CDN Optimized

Key Features

  1. Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP.
  2. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM
  3. 1 PCIe 4.0 x16 (FHHL) slot
  4. Intel® Ethernet Controller X550 2x 10GbE RJ45
  5. 10x Hot-swap 2.5'' All NVMe Gen 4 tool-less drive bays; Onboard 2x NVMe Gen 3/SATA M.2
  6. Redundant Platinum 860W Power Supply
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Specifications Resources Parts List
Specifications
Product SKUs
SuperServer SSG-110P-NTR10 Standard version (Black) with PWS-860P-1R2 (Platinum Level)
SuperServer SSG-110P-NTR10-EU European version (Black) with PWS-861A-1R (Titanium Level)
Motherboard
Super X12SPO-NTF
Processor
CPU
  • Single Socket P+ (LGA-4189)
  • 3rd Gen Intel® Xeon® Scalable processors
Core Count
  • Up to 40C/80T; Up to 60MB Cache per CPU
Note
  • Supports up to 270W TDP CPUs (Air Cooled)
System Memory
Memory
  • Memory Capacity: 8 DIMM slots
  • Up to 2TB: 8x 256 GB DRAM
  • Up to 3TB: 4x 256 GB DRAM and 4x 512 GB PMem
  • Memory Type: 3200/2933/2666MHz ECC DDR4 RDIMM;LRDIMM
  • Intel® Optane™ persistent memory 200 series
Memory Voltage
  • 1.2 V
Error Detection
  • Yes
On-Board Devices
NVMe
  • NVMe Gen 4 via MB onboard controller; RAID 0, 1, 5, 10 support (with additional VROC module)
Chipset
  • Intel® C621A
Network Connectivity
  • 2x 10GbE BaseT with Intel® X550
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN
  • 1 RJ45 Dedicated IPMI LAN port
  • 2 RJ45 10GBase-T LAN ports
USB
  • 5 USB 3.2 Gen 1 port(s) (2 front; 2 rear; 1 Type A)
  • 4 USB 2.0 port(s) (2 headers; 2 rear)
Video
  • 1 VGA port(s)
Serial Port
  • 2 COM Port(s) (1 header; 1 rear)
DOM
  • 2 SuperDOM (Disk on Module) port with built-in power
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
Management
Software
Power Configurations
  • ACPI/APM Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • System Lockdown
PC Health Monitoring
CPU
  • 7+1 Phase-switching voltage regulator module (VRM)
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 1U Rackmount
Model
  • CSE-116TS-R860CBP-N10
Dimensions and Weight
Height
  • 1.7" (43mm)
Width
  • 17.2" (437mm)
Depth
  • 23.5" (597mm)
Package
  • 8" (H) x 24" (W) x 32" (D)
Weight
  • Net Weight: 25 lbs (11.34 kg)
  • Gross Weight: 38 lbs (17.24 kg)
Available Color
  • Black
Front Panel
Buttons
  • Power On/Off 
  • UID button
LEDs
  • Device Activity
  • LAN 1 Activity
  • LAN 2 Activity
  • Power status
  • System information
Expansion Slots
PCI-Express (PCIe)
  • 1 PCIe 4.0 x16 FHHL slot(s)
Drive Bays / Storage
Hot-swap
  • 10x 2.5" hot-swap NVMe drive bays (10x 2.5" NVMe dedicated)
M.2
  • 2x PCIe 3.0 x4 and SATA
  • Form Factor: 2280, 22110
  • Key: M-key
System Cooling
Fans
  • 6x (4cm x4cm x5.6cm) heavy duty fans with optimal fan speed control
Air Shroud
  • 1 Air Shroud(s)
Power Supply
860W Redundant Platinum Level power supplies
Note: SSG-110P-NTR10-EU (European) SKU uses PWS-861A-1R (Titanium Level)
Dimension

(W x H x L)
  • 54.5 x 40.25 x 322 mm
AC Input
  • 800W: 100-127Vac
  • 800W: 100-127Vac / 50-60Hz
  • 860W: 200-240Vac
  • 860W: 200-240Vdc / 50-60Hz
  • 860W: 200-240Vac / 50-60Hz
+12V
  • Max: 66.6A / Min: 0A (100Vac-127Vac)
  • Max: 71.6A / Min: 0A (200Vdc-240Vdc)
  • Max: 71.6A / Min: 0A (200Vac-240Vac)
5V SB
  • Max: 4A / Min: 0A
Output Type
  • Backplanes (gold finger)
Certification Platinum Level Certified94%+   Platinum Level

 

  [ Test Report ]
Operating Environment
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)


Resources
Component Options
NVMe OptionsTested AOC ListTested M.2 ListTested Memory
Documentation
ManualsQuick Reference Guide
Software
BIOS DownloadBMC DownloadDrivers & UtilitiesOS Certification
Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-X12SPO-NTF

CSE-116TS-R860CBP-N10 		1

1 		Super X12SPO-NTF Motherboard

1U Chassis
Backplane BPN-SAS3-LB16A-N10 1 1U 10-Slot SFF Hybrid Backplane Supports 10xSAS3/SATA3/NVMe4 Storage Devices with 1x(2x4) + 2x(1x4) + 1x(2x2) Power Connectors
Cable CBL-0062L 1 12V 8 TO 8 PIN POWER CONNECTOR EXTENSION, LF
CBL-SAST-1231-85 1 Slimline x8 (STR) to Slimline x8 (STR),INT,30CM, 85 OHM
CBL-SAST-1267-85 4 Slimline x8 (STR) to Slimline x8 (STR),INT,67CM,85 OHM,
CBL-0335L 1 FRONT CTL CABLE 20 PIN TO 20 PIN W/TUBE,70CM,PBF
CBL-PWCD-0160-IS 2 PWCD,US,NEMA5-15P TO IEC60320 C13,6FT,16AWG,RoHS/REACH
Fan FAN-0141L4 6 40x40x56 mm 20.5K RPM / 17.6K RPM Counter-rotating Fan
Manual MNL-2366-QRG 1 110P-NTR10 Quick Reference Guide
Riser Card RSC-S-6G4 1 1U LHS Standard riser card with one PCIe 4.0 x16 slot,HF,Ro
Software SFT-OOB-LIC 1 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0077P 1 1U Passive CPU Heat Sink for X12 Generation Intel Whitley and Cedar Island Platforms
*Power Supply PWS-860P-1R2 2 1U 860W, Redundant power supply, 54.5mm width, Platinum with
MCP-250-00009-0N 1 SC113 Redundant Power Distributor Cover
*Power Distributor PDB-PT112-2424 1 SC112 24PIN REDUNDANT PWS DISTRIBUTOR
*Front Panel FPB-FP116-DU3 1 Front control board with two USB 3.0 for SC116/SC119X
*Drive Tray(s) MCP-220-00167-0B 10 Gen 3 2.5-inch Tool-less NVMe drive tray (clip design),RoHS
*Rear Window MCP-240-00086-0N 1 STD rear window for SC113 redundant PWS
*Parts MCP-260-00078-0N 1 1U I/O shield for X10 and X9 Server MB with 5X5mm vent hole and EMI Gasket,RoHS/REACH,PBF
*Rail Set MCP-290-00016-0N 1 1U open rack bracket set for CSE-PT51L,MCP-290-00054-0N
MCP-290-00063-0N 1 set Rail set, quick/quick, default for 1U 17.2"W for SC113/SC116,RoHS/REACH
*Air Shroud MCP-310-19002-0N 1 SC815/113/116 Intel DP X9, X8 PC air shroud, 12x13MB
*Fan Holder MCP-320-00027-0B 24 Plastic pin for 40x28, 40x56 fan
MCP-320-00028-0B 1 Fan holder for 6pcs 40x56 fan, assemble-able for SC819/SC119/SC818/SC116
MCP-340-00035-0B 2 Dummy fan 40x56mm for 40x56 counter-rotating fan (cost-effective)
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
Optional Parts List
Part Number Qty Description
Inlet Thermal Sensor MCP-280-00033-0N 1 Universal Thermal sensor kit with 80cm I2C cable
Intel VROC RAID Key for NVMe AOC-VROCPREMOD • 1 Premium Upgrade module (Intel + 3rd party Vendor SSD); RAID 0/1/10/5
AOC-VROCSTNMOD 1 Standard Upgrade module (Intel + 3rd party Vendor SSD); RAID 0/1/10
AOC-VROCINTMOD 1 Intel SSD Only Upgrade module; RAID 0/1/10/5
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
TPM AOM-TPM-9671H-S-O 1 TPM 1.2, horizontal form factor, provisioned for server
AOM-TPM-9670H-S-O 1 TPM 2.0, horizontal form factor, provisioned for server
UP Storage SuperServer SSG-110P-NTR10 (Complete System Only )