SuperServer SSG-110P-NTR10 (Complete System Only)

1U UP front-loading storage server with 10 hot-swap 2.5" NVMe bays and PCIe 4.0

SSG-110P-NTR10 Main SSG-110P-NTR10 Angle SSG-110P-NTR10 Top SSG-110P-NTR10 Front SSG-110P-NTR10 Rear
Integrated Board: X12SPO-NTF
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Key Applications

  • Virtualization
  • Cloud Computing
  • All Flash Storage
  • CDN Optimized

Key Features

  1. Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP.
  2. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® Intel® DCPMM
  3. 1 PCIe 4.0 x16 (FHHL) slot
  4. Intel® Ethernet Controller X550 2x 10GbE RJ45
  5. 10x Hot-swap 2.5'' All NVMe Gen 4 tool-less drive bays; Onboard 2x NVMe Gen 3/SATA M.2
  6. Redundant Platinum 860W Power Supply
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SSG-110P-NTR10
Specifications Resources & Downloads Parts List
Specifications
Product SKUs
SuperServer SSG-110P-NTR10 Standard version with PWS-860P-1R2 (Platinum Level)
SuperServer SSG-110P-NTR10-EU European version with PWS-861A-1R (Titanium Level)
Motherboard
Super X12SPO-NTF
Processor
CPU
  • Single Socket P+ (LGA-4189)
  • 3rd Gen Intel® Xeon® Scalable processors
Core Count
  • Up to 40C/80T; Up to 60MB Cache
Note
  • Supports up to 270W TDP CPUs (Air Cooled)
System Memory
Memory
  • Slot Count: 8 DIMM slots
  • Max Memory (1DPC): Up to 2TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
  • Supports Intel® Optane™ persistent memory 200 series
  • View Memory Options
Memory Voltage
  • 1.2V
On-Board Devices
NVMe
Chipset
  • Intel® C621A
Network Connectivity
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN
  • 2 RJ45 1 GbE LAN port(s)
  • 1 RJ45 1 GbE Dedicated IPMI LAN port(s) (IPMI shared on LAN port 1)
USB
  • 2 USB 2.0 port(s) (header)
  • 2 USB 3.2 Gen1 Type-A port(s) (rear)
  • 2 USB 2.0 Type-A port(s) (rear)
  • 2 USB 3.2 Gen1 Type-A port(s) (front)
  • 1 USB 3.2 Gen1 Type-A port(s)
Video
  • 1 VGA port(s)
Serial
  • 1 COM port(s) (Rear)
  • 1 COM port(s) (Header)
DOM
  • 2 SuperDOM (Disk on Module) port(s) with built-in power
TPM
  • 1 TPM header
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
Management
Software
Power configurations
  • ACPI/APM Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
  • 7+1 Phase-switching voltage regulator module (VRM)
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 1U Rackmount
Model
  • CSE-116TS-R860CBP-N10
chassisWeight
  • Net Weight: 25 lbs (11.34 kg)
  • Gross Weight: 38 lbs (17.24 kg)
Dimensions and Weight
Height
  • 1.7" (43 mm)
Width
  • 17.2" (437 mm)
Depth
  • 23.5" (597 mm)
Package
  • 8" (H) x 24" (W) x 32" (D)
Weight
  • Gross Weight: 38 lbs (17.24 kg)
  • Net Weight: 25 lbs (11.34 kg)
Available Color
  • Black
Front Panel
LED
  • Device Activity
  • LAN 1 Activity
  • LAN 2 Activity
  • Power status
  • System information
Buttons
  • Power On/Off 
  • UID button
Expansion Slots
PCI-Express (PCIe) Configuration
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 10 bay(s)
    • 10 front hot-swap 2.5" PCIe 4.0 NVMe drive bay(s)
M.2
  • 2 M.2 PCIe 3.0 x4 NVMe/SATA slot(s) (M-key 2280/22110; VROC required for RAID)
  • View M.2 Options
System Cooling
Fans
  • 6 Counter-rotating PWM 40x40x56mm Fan(s)
Power Supply
2x 860W Redundant (1 + 1) Platinum Level power supplies
Note: SSG-110P-NTR10-EU (European) SKU uses PWS-861A-1R (Titanium Level)
Dimension (WxHxL)
  • 54.5 x 40.25 x 322 mm
+12V
  • Max: 66.6A / Min: 0A (100Vac-127Vac)
  • Max: 71.6A / Min: 0A (200Vdc-240Vdc)
  • Max: 71.6A / Min: 0A (200Vac-240Vac)
5V SB
  • Max: 4A / Min: 0A
AC Input
  • 800W: 100-127Vac / 50-60Hz
  • 860W: 200-240Vdc / 50-60Hz
  • 860W: 200-240Vac / 50-60Hz
Output Type
  • Backplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources & Downloads
Parts List
Optional Parts List
Part Number Qty Description
Inlet Thermal Sensor MCP-280-00033-0N 1 Universal Thermal sensor kit with 80cm I2C cable
Intel VROC RAID Key for NVMe AOC-VROCINTMOD 1 Intel SSD Only Upgrade module; RAID 0/1/10/5
AOC-VROCSTNMOD 1 Standard Upgrade module (Intel + 3rd party Vendor SSD); RAID 0/1/10
AOC-VROCPREMOD 1 Premium Upgrade module (Intel + 3rd party Vendor SSD); RAID 0/1/10/5
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
TPM AOM-TPM-9670H-S-O 1 TPM 2.0, horizontal form factor, provisioned for server
AOM-TPM-9671H-S-O 1 TPM 1.2, horizontal form factor, provisioned for server
UP Storage SuperServer SSG-110P-NTR10 (Complete System Only )