Super Micro Computer, Inc.
 
BigTwin™ Solutions | Super Micro Computer, Inc.

Products
SuperServer®
Storage
Motherboards
Chassis
SuperWorkstation
SuperBlade®
MicroBlade™
Ultra (new)
WIO
Twin Solutions   BigTwin™ (new)   FatTwin™   2U TwinPro™   1U TwinPro™   2U Twin2®   2U Twin   1U Twin   Success Stories
MP Servers
GPU / Coprocessor
MicroCloud
Networking
Embedded
Gaming
AMD Solutions
Power Supplies
Accessories
SuperRack®
Server Management


White Paper: CAPEX Savings and Performance Advantages of BigTwin's Memory Optimization



SuperMinute: X11 BigTwin™



SuperMinute: BigTwin™



Video: BigTwin™ Loop



BigTwin™ White Paper



BigTwin™ Datasheet



BigTwin Supermicro BigTwin™ Solutions


The Supermicro BigTwin™ is the first and only 2U multi-node system supporting the highest performance processor, memory, storage, I/O and an incredible 30% better thermal capacity. The 5th generation of Supermicro's Twin architecture is fully optimized for today's diverse workloads and architected for further technology breakthroughs.

  • Performance: Supporting the latest Intel® Xeon® Scalable processors up to 205W, the BigTwin achieves incredible performance in a 2U multi-node platform. The latest processors from Intel incorporate Ultra Path Interconnect (UPI) technology for significantly improved communication between CPUs to reduce latency and provide extra bandwidth for intense workloads.

    Each node of the BigTwin supports up to 3TB DDR4-2666MHz in 24 DIMM slots for dramatically faster and increased memory capacity compared to previous generations of Twin systems. With up to 12 hot-swappable 2.5" drive bays per node, storage performance is accelerated with options for All-Flash NVMe, SAS or SATA drives.

  • Density: BigTwin systems boast incredibly high density with up to 4 hot swappable nodes in a 2U form factor, and double the I/O capacity of competitive 2U solutions. Support for Supermicro I/O Module (SIOM) enables flexible networking options of 1G, 10G, 25G, or 100G Ethernet or 100G InfiniBand/Omni-Path and frees up 2 low-profile PCI-E 3.0 x16 expansion slots per node.

  • Efficiency: Supermicro's Twin architecture is designed with power and cost efficiency in mind. The BigTwin reduces power consumption with shared cooling and power design, leveraging redundant 2200W high efficiency (96%) power supplies. Maximum compute in a 2U system enables data center footprints to be reduced by 50% compared to standard 2U servers with equivalent performance.





SIOM Cards
Product Brief


Generation: | Display All | X11 | X10 |

Display Filter: | Display All | 2.5" Drive Bays | 3.5" Drive Bays |





BigTwin
BigTwin™
4 NVMe/SATA3 +
2 SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 4 Hot-swap 2.5" NVMe/SATA3 + 2 Hot-swap 2.5" SATA3 drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
BigTwin™
6 NVMe per Node
N+1 Cooling


  • 4 DP nodes in 2U; depth 28.75", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4 2666MHz
  • 6 Hot-swap 2.5" NVMe drive bays per node; 2 M.2 SATA3 or NVMe support
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 16 Heavy duty 40x56mm fans w/ optimal fan speed control (4 fans per node)
  • 2600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SAS3/SATA3 +
2 SAS3/SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 support via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60
  • 1 PCI-E 3.0 x16 Low-profile slot, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
BigTwin™
6 NVMe per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 6 Hot-swap 2.5" NVMe drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SAS3/SATA3 +
2 SAS3/SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
BigTwin™
6 SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 6 Hot-swap 2.5" SATA3 drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SAS3 +
8 SAS3 per Node


  • 2 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 4 NVMe/SAS3 + 8 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 (12Gbps) support via Broadcom 3216; IT mode
  • 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
BigTwin™
3 NVMe/SAS3 + 3 SAS3 per Node


  • 2 DP nodes in 2U; depth 30.11", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processor; dual UPI up to 10.4GT/s
  • 24 DIMM slots; up to 3TB ECC 3DS L/RDIMM, up to DDR4‑2666MHz
  • 3 NVMe/SAS3 + 3 SAS3 Hot-swap 3.5" drive bays per node, 2 Internal M.2 NVMe/SATA slots
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
BigTwin™
3 NVMe/SAS3 per Node


  • 4 DP nodes in 2U; depth 30.11", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMM slots; up to 3TB ECC 3DS L/RDIMM, up to DDR4‑2666MHz
  • 3 Hot-swap NVMe/SAS3 drive bays per node
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 


Click for Logo Guidelines
Investor Relations    |   Jobs    |   Site Map    |   Follow Us    |   Terms & Conditions    |   Privacy
Copyright © 2018 Super Micro Computer, Inc. Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.