Super Micro Computer, Inc.
 

Products
SuperServer®
Storage
Motherboards
Chassis
SuperWorkstation
SuperBlade®
MicroBlade™
Ultra (new)
WIO
Twin Solutions (new)
MP Servers
GPU / Coprocessor
MicroCloud
Networking
Embedded
Gaming
AMD Solutions
Power Supplies
Accessories
SuperRack®
Server Management

Supermicro Solutions based on Intel® Xeon® Processor E5 Family


NEW! With E5-2600 v4 Support
SuperServer®
Motherboard
SuperBlade®
MicroBlade™

Workstation

  Serverboards SKUs - Display  |  All  |  UP  |  DP  | or Socket R3 (E5) / H3 (E3)  |

  SuperWorkstation Serverboards

Supermicro's server grade SuperWorkstation motherboards support up to: 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400MHz memory in 16 DIMM slots, 5 PCI-E 3.0 x16 slots for GPU/Xeon Phi™ cards, 8 ports of Broadcom 3008 SAS 3.0 (12Gbps) with Software RAID, and dual Gigabit Ethernet LAN ports. Other important workstation features include 7.1 HD audio, 11 USB ports (6 USB 3.0), SLI, Thunderbolt AOC, Hyper-Speed Hardware Acceleration and 160W CPU support with dual or single Intel® Xeon® processor E5-2600/1600 v4/v3 product families up to 22 cores.

Supermicro SuperWorkstation motherboards are optimized for customer applications requiring high I/O throughput, storage capacity, and powerful graphics capabilities. In addition, with Supermicro's signature server grade quality and support, customers will benefit from more processing capacity in less space with better efficiency.

Supermicro SuperWorkstation motherboards are optimized for customer applications requiring high I/O throughput, storage capacity, and powerful graphics capabilities including Science & Engineering, CAD/CAE/CAM, Digital Content Creation, Oil & Gas, and Digital Imaging. The rich multimedia features are excellent for Digital Entertainment.




7.1 HD Audio

X10DAL-i
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor
   E5-2600 v4/v3 family; QPI up to 9.6GT/s
• Intel® C612 Express chipset
• 8x DIMMs, up to 1TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 2x PCI-E 3.0 x16, 1x PCI-E 3.0 x8 (in x16), 1x PCI-E 3.0 x4 (in x8),
   1x PCI-E 2.0 x4 (in x8) slots
• Intel® i210 Dual port Gigabit Ethernet
• 10x SATA3 (6Gbps) ports via C612
• 6x USB 3.0 ports (4 rear + 2 via header)
• 3x USB 2.0 ports (2 via header + 1x Type A)
• 2x SuperDOM (Disk on Module) ports
• 7.1 HD 8 Channel Audio with S/PDIF header
• Form factor: ATX, 12" x 10"
 


7.1 HD Audio

X10DAi
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor
   E5-2600 v4/v3 family; QPI up to 9.6GT/s
• Intel® C612 Express chipset
• 16x DIMMs, up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 3x PCI-E 3.0 x16, 2x PCI-E 3.0 x8, 1x PCI-E 2.0 x4 (in x8) slots
• Intel® i210 Dual port Gigabit Ethernet
• 10x SATA3 (6Gbps) ports via C612
• 6x USB 3.0 ports (4 rear + 2 via header) + 1x Type A
• 4x USB 2.0 ports (2 rear + 2 via header)
• 2x SuperDOM (Disk on Module) ports
• 7.1 HD 8 Channel Audio with S/PDIF header
• Form factor: E-ATX, 12" x 13"
 


Broadcom 3008 SAS3
7.1 HD Audio

X10DAC
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor
   E5-2600 v4/v3 family; QPI up to 9.6GT/s
• Intel® C612 Express chipset
• 16x DIMMs, up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 3x PCI-E 3.0 x16, 2x PCI-E 3.0 x8, 1x PCI-E 2.0 x4 (in x8) slots
• Intel® i210 Dual port Gigabit Ethernet
• 8x SAS3 (12Gbps) ports via Broadcom 3008; SW RAID 0, 1, 10
• 10x SATA3 (6Gbps) ports via C612
• 6x USB 3.0 ports (4 rear + 2 via header) + 1x Type A
• 4x USB 2.0 ports (2 rear + 2 via header)
• 2x SuperDOM (Disk on Module) ports
• 7.1 HD 8 Channel Audio with S/PDIF header
• Form factor: E-ATX, 12" x 13"
 


Thunderbolt Ready
NVIDIA SLI Ready
7.1 HD Audio

X10DAX
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor
   E5-2600 v4/v3 family; QPI up to 9.6GT/s
• Intel® C612 Express chipset
• 16x DIMMs, up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 3x PCI-E 3.0 x16, 2x PCI-E 3.0 x8, 1x PCI-E 2.0 x4 (in x8) slots
• Intel® i210 Dual port Gigabit Ethernet
• 10x SATA3 (6Gbps) ports via C612
• 6x USB 3.0 ports (4 rear + 2 via header)
• 5x USB 2.0 ports (2 rear + 2 via header + 1 Type A)
• 2x SuperDOM (Disk on Module) ports
• 7.1 HD 8 Channel Audio with S/PDIF header
• Form factor: E-ATX, 12" x 13"
 


X10DRX
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor
   E5-2600 v4/v3 family; QPI up to 9.6GT/s
• Intel® C612 Express chipset
• 16x DIMMs, up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 10x PCI-E 3.0 x8 and 1x PCI-E 2.0 x4 (in x8) slots
• Intel® i350 Dual port Gigabit Ethernet
• IPMI 2.0 and KVM with dedicated LAN
• 10x SATA3 (6Gbps) ports via C612
• 5x USB 3.0 ports (2 rear + 2 via header + 1 Type A)
• 4x USB 2.0 ports (2 rear + 2 via header)
• 2x SuperDOM (Disk on Module) ports
• Form factor: Proprietary, 15.2" x 13.2"
 


X10DRG-OT+-CPU / X10DRG-O+-CPU
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor
   E5-2600 v4/v3 family; QPI up to 9.6GT/s
• Intel® C612 Express chipset
• 24x DIMMs, up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 8x PCI-E 3.0 x16, 2x PCI-E 3.0 x8 (in x16), 1x PCI-E 2.0 x4 (in x16) slots
• Intel® i350 Dual port Gigabit Ethernet (X10DRG-O+-CPU)
• Intel® X540 Dual port 10GBase-T (X10DRG-OT+-CPU)
• IPMI 2.0 and KVM with dedicated LAN
• 10x SATA3 (6Gbps) ports via C612
• 5x USB 3.0 ports (4 rear + 1 Type A)
• 4x USB 2.0 ports (via headers)
• 2x SuperDOM (Disk on Module) ports
• Form factor: Proprietary, 17.0" x 19.5"
 


X10DGQ
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor
   E5-2600 v4/v3 family; QPI up to 9.6GT/s
• Intel® C612 Express chipset
• 16x DIMMs, up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 4x PCI-E 3.0 x16 and 2x PCI-E 3.0 x8 slots
• Intel® i350 Dual port Gigabit Ethernet (via AOM-PIO-i2G)
• Intel® X540 Dual port 10GBase-T (via AOM-PIO-i2XT)
• IPMI 2.0 and KVM with dedicated LAN
• 10x SATA3 (6Gbps) ports via C612
• 2x USB 3.0 ports (via headers)
• 2x SuperDOM (Disk on Module) ports
• Form factor: Proprietary, 13.2" x 14.75"
 


X10DRG-Q
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor
   E5-2600 v4/v3 family; QPI up to 9.6GT/s
• Intel® C612 Express chipset
• 16x DIMMs, up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 4x PCI-E 3.0 x16, 1x PCI-E 3.0 x8 (in x16), 1x PCI-E 3.0 x8
   and 1x PCI-E 2.0 x4 (in x8) slots
• Intel® i350 Dual port Gigabit Ethernet
• IPMI 2.0 and KVM with dedicated LAN
• 10x SATA3 (6Gbps) ports via C612
• 4x USB 3.0 ports (2 rear + 2 via header) + 1x Type A
• 4x USB 2.0 ports (2 rear + 2 via header)
• 2x SuperDOM (Disk on Module) ports
• HD Audio (via header)
• Form factor: Proprietary WIO, 15.2" x 13.2"
 



Solution Families:

  • SuperServer®
  • Ultra
  • Twin Server
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Xeon Phi™
  • Mainstream App.Optimized
  • SuperStorage
  • SuperWorkstation

  • SuperBlade®
  • MicroBlade™



Support Resources:

MBSA Tool
  • X10 DP MB Selection Tool
  • X10 Heat Sink Support



New Generation of
Computing Excellence:

  • 22 Cores CPU; 160W TDP
  • Up to 3TB ECC 3DS LRDIMM
    or RDIMM DDR4-2400MHz
  • Up to 30% performance gain
  • SAS 3.0 (12Gbps)
  • NVMe support
  • Quad 10GBase-T
  • 10G SFP+
  • FDR (56Gbps) InfiniBand
  • SuperDOM support
  • TPM Security Module support
  • Titanium Level (96%+) PS


New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries

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