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Servers Optimized for Highest Performance-per-Watt White Paper



Servers Optimized for Highest Performance-per-Watt White Paper



Energy Efficient Servers



FatTwin™ Power Savings Whitepaper



Data Center Power Saving with Supermicro



View Video:
FatTwin Power Savings



View Video:
4-Node Front I/O



View Video:
FatTwin Advantage



View Video:
Free-Air Cooling




 

2U Twin^2 Solutions Supermicro FatTwin Server Solutions



Titanium Level 96% Efficiency
FatTwin™ Server Solution - Best TCO with Highest Performance-per-Watt/per-Dollar

The new generation X11 Supermicro FatTwin™ is a high-density 8/4 hot-plug node SuperServer® system available with a variety of memory capacities, HDD technologies, M.2 SSD NVMe, PCIe alternatives, and networking capabilities. The FatTwin™ supports up to: 1.5TB ECC RDIMM DDR4-2666MHz memory in 12 DIMM slots, 1 PCI-E 3.0 x16 and 1 SIOM flexible nework card 8 ports of Broadcom SAS 3.0 (12Gbps) HBA or HW RAID, 10 ports of SATA 3.0 (6Gbps) with Intel® C621 controller, redundant Titanium Level (96%) Digital power supplies, integrated IPMI 2.0 with KVM over dedicated LAN, and dual Intel® Xeon® Scalable processor families up to 26 cores and 165W TDP.

The Supermicro FatTwin™ represents a revolution in Green Computing and is highly efficient by design; this system supports customers' critical applications while reducing Data Center TCO in order to help preserve the environment, and extends the compute and storage capabilities of Supermicro's existing Twin SuperServer® systems to achieve increased performance and power efficiency. Due to its shared components, the FatTwin™ improves cost-effectiveness and reliability, while its modular architecture makes it flexible to configure and easy to maintain.

Versatile configurations allow the FatTwin™ to be optimized for many different environments including Enterprise, Data Center, Cloud Computing, HPC, Financial, Science and Engineering, File and Storage Servers.

  • NEW! Support for New Generation X11 Solutions with Dual Intel® Xeon® Scalable processor up to 165W per node
  • 12 DIMM slots; Up to 1.5TB ECC RDIMM
  • Low-Profile PCI-E 3.0 x16 slot
  • SAS3/SATA3/NVMe support
  • Redundant 2200W/1200W Titanium (96%) Power Supplies



 

X10 X11

  Solution Families -
Application / Product Families: | Display All | GPGPU | Hadoop/Storage | NVMe Ready |
Display by Features: | Front / Rear I/O | 2.5" / 3.5" | 4 / 8 Node | 29" / 35" Enclosure |



F618H6-FT(PT)+ Front SYS-F618H6-FTPT+ / SYS-F618H6-FT+ (Hadoop, 4 DP Nodes with Front I/O)

Key Features
• Up to 12 Fixed 3.5" SATA3 drives per U
• Evolutionary 4U Twin Architecture that Offers Industry's Best Capacity and Efficiency
• 4 Hot-plug System Nodes in 4U
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family
• 16 DIMM slots; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400MHz
• 2 PCI-E 3.0 x8 (LP) expansion slots via riser card
• Ports: 2 GbE/10GBase-T ("PT"), 1 Video, 2 USB 3.0
TItaninum Level • Server Management with Onboard IPMI 2.0 through Dedicated LAN Port
• 8x 8cm heavy duty fans with PWM fan speed control
• 2000W Redundant Titanium Level (96%) High-efficiency Digital Power Supplies



F618H6-FT(PT)L+ Front SYS-F618H6-FTPTL+ / SYS-F618H6-FTL+ (Hadoop, 4 DP Nodes with Front I/O)

Key Features
• Up to 8 Fixed 3.5" SAS/SATA + 4 Fixed 3.5" SATA HDDs per U
• Evolutionary 4U Twin Architecture that Offers Industry's Best Capacity and Efficiency
• 4 Hot-plug System Nodes in 4U
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family
• 16 DIMM slots; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400MHz
• 2 PCI-E 3.0 x8 (LP) expansion slots via riser card
• Ports: 2 GbE/10GBase-T ("PT"), 1 Video, 2 USB 3.0
TItaninum Level • Server Management with Onboard IPMI 2.0 through Dedicated LAN Port
• SAS3 (12Gbps) via Broadcom 3008 controller; SW RAID 0, 1, 10 support
• 8x 8cm heavy duty fans with PWM fan speed control
• 2000W Redundant Titanium Level (96%) High-efficiency Digital Power Supplies



F628G3-F Front
SYS-F628G3-FT+ / SYS-F628G3-FTPT+ / SYS-F628G3-FC0+ / SYS-F628G3-FC0PT+
(12 GPU/Coprocessor MIC, Front I/O)

Key Features
• Up to 2 Hot-swap 3.5" SATA (-FT+/-FTPT+) or SAS3 (-FC0+/-FC0PT+) HDDs per U
• Outstanding high-density compute performance for Engineering and Scientific Research,
   Modeling, Simulation and HPC applications
• 4 Hot-plug System Nodes in 4U
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family
• 16 DIMM slots; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400MHz
• 3 PCI-E 3.0 x16 support 3 Double-width GPU/MIC; and 2 PCI-E 3.0 x8 Low-profile slots
• Ports: 2 GbE/10GBase-T ("PT"), 1 Video, 2 USB 3.0
TItaninum Level • Server Management with Onboard IPMI 2.0 through Dedicated LAN Port
• SAS3 (12Gbps) via Broadcom 3008 controller ("C0"); SW RAID 0, 1 support
• 8x 8cm heavy duty 11K fans with air shroud and PWM fan speed control
• 2000W Redundant Titanium Level (96%) High-efficiency Digital Power Supplies



F628G2-F Front
SYS-F628G2-FT+ / SYS-F628G2-FTPT+ / SYS-F628G2-FC0+ / SYS-F628G2-FC0PT+
(12 GPU/Coprocessor MIC, Front I/O)

Key Features
• Up to 6 Hot-swap 2.5" SATA (-FT+/-FTPT+) or SAS3 (-FC0+/-FC0PT+) HDDs per U
• Outstanding high-density compute performance for Engineering and Scientific Research,
   Modeling, Simulation and HPC applications
• 4 Hot-plug System Nodes in 4U
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family
• 16 DIMM slots; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400MHz
• 3 PCI-E 3.0 x16 support 3 Double-width GPU/MIC; and 2 PCI-E 3.0 x8 Low-profile slots
• Ports: 2 GbE/10GBase-T ("PT"), 1 Video, 2 USB 3.0
TItaninum Level • Server Management with Onboard IPMI 2.0 through Dedicated LAN Port
• SAS3 (12Gbps) via Broadcom 3008 controller ("C0"); SW RAID 0, 1, 10 support
• 8x 8cm heavy duty 11K fans with air shroud and PWM fan speed control
• 2000W Redundant Titanium Level (96%) High-efficiency Digital Power Supplies



F647G2-F Front
SYS-F648G2-FT+ / SYS-F648G2-FTPT+ / SYS-F648G2-FC0+ / SYS-F648G2-FC0PT+
(12 GPU/Coprocessor , Front I/O)

Key Features
• Outstanding high-density compute performance for Engineering and Scientific Research,
   Modeling, Simulation and HPC applications
• 2 Hot-plug System Nodes in 4U supporting 12 double-width GPU/Coprocessor , each Node:
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family
• 8 Hot-swap 2.5" SATA3 (-FT+/-FTPT+) or SAS3 (-FC0+/-FC0PT+) HDDs; SAS3 via Broadcom 3008
• 16 DIMM slots; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400MHz
• 6 PCI-E 3.0 x16 support 6 Double-width GPU/Coprocessor ; and 2 PCI-E 3.0 x8 FHHL slots
• I/O ports: 2x GbE (-FT+/-FC0+)/10GBase-T (-FTPT+/-FC0PT+), 1x Video, 2x USB 3.0
TItaninum Level • System management: Built-in Server management tool
   (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
• 8 heavy duty rear fans, optional rear fan w/ Optimal Fan Speed Control
• 2000W Redundant Titanium Level (96%) High-efficiency Digital Power Supplies



F627G3-F Front
SYS-F627G3-FT+ / SYS-F627G3-FTPT+ / SYS-F627G3-F73+ / SYS-F627G3-F73PT+
(12 GPU/Coprocessor MIC, Front I/O)

Key Features
• Outstanding high-density compute performance for Engineering and Scientific Research,
   Modeling, Simulation and HPC applications
• 4x 1620W Redundant Platinum Level Power Supplies
• 4 Hot-plug System Nodes in 4U supporting 12 double-width GPU/Coprocessor MIC, each Node:
• Up to 2 Hot-swap3.5" SATA (-FT+/-FTPT+) or SAS2 (-F73+/-F73PT+) HDDs per U
• Dual Intel® Xeon® Processor E5-2600 or E5-2600 v2 Family; Socket R (LGA 2011)
• 16 DIMMs, up to 1TB, up to 1866MHz DDR3 memory
• 3 PCI-E 3.0 x16 support 3 Double-width GPU/MIC; and 2 PCI-E 3.0 x8 Low-profile slots
Platinum Level • Dual LAN ports via Intel® i350 Gigabit Ethernet (F627G3-FT+/-F73+)
• Dual LAN ports via Intel® X540 10GBase-T (F627G3-FTPT+/-F73PT+)
• Server Management with Onboard IPMI 2.0 through Dedicated LAN Port
• Standard 19" Rack Cabinet support



F627G2-F Front
SYS-F627G2-FT+ / SYS-F627G2-FTPT+ / SYS-F627G2-F73+ / SYS-F627G2-F73PT+
(12 GPU/Coprocessor MIC, Front I/O)

Key Features
• Outstanding high-density compute performance for Engineering and Scientific Research,
   Modeling, Simulation and HPC applications
• 4x 1620W Redundant Platinum Level Power Supplies
• 4 Hot-plug System Nodes in 4U supporting 12 double-width GPU/Coprocessor MIC, each Node:
• Up to 6 Hot-swap 2.5" SATA (-FT+/-FTPT+) or SAS2 (-F73+/-F73PT+) HDDs per U
• Dual Intel® Xeon® Processor E5-2600 or E5-2600 v2 Family; Socket R (LGA 2011)
• 16 DIMMs, up to 1TB, up to 1866MHz DDR3 memory
• 3 PCI-E 3.0 x16 support 3 Double-width GPU/MIC; and 2x PCI-E 3.0 x8 Low-profile slots
Platinum Level • Dual LAN ports via Intel® i350 Gigabit Ethernet (F627G2-FT+/-F73+)
• Dual LAN ports via Intel® X540 10GBase-T (F627G2-FTPT+/-F73PT+)
• Server Management with Onboard IPMI 2.0 through Dedicated LAN Port
• Standard 19" Rack Cabinet support



F647G2-F Front
SYS-F647G2-FT+ / SYS-F647G2-FTPT+ / SYS-F647G2-F73+ / SYS-F647G2-F73PT+
(12 GPU/Coprocessor , Front I/O)

Key Features
• Outstanding high-density compute performance for Engineering and Scientific Research,
   Modeling, Simulation and HPC applications
• 4x 2000W Redundant Platinum Level Power Supplies
• 2 Hot-plug System Nodes in 4U supporting 12 double-width GPU/Coprocessor , each Node:
• Up to 6 Hot-swap 2.5" SATA (-FT+/-FTPT+) or SAS2 (-F73+/-F73PT+) HDDs per U
• Dual Intel® Xeon® Processor E5-2600 or E5-2600 v2 Family; Socket R (LGA 2011)
• 16 DIMMs, up to 1TB, up to 1866MHz DDR3 memory
• 6 PCI-E 3.0 x16 support 6 Double-width GPU/Coprocessor ; and 2 PCI-E 3.0 x8 Low-profile slots
Platinum Level • Dual LAN ports via Intel® i350 Gigabit Ethernet (F627G2-FT+/-F73+)
• Dual LAN ports via Intel® X540 10GBase-T (F627G2-FTPT+/-F73PT+)
• Server Management with Onboard IPMI 2.0 through Dedicated LAN Port
• Standard 19" Rack Cabinet support



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