Designed for a Faster, Better, and Greener Hyperscale infrastructure from the edge to the cloud
Today, the modern data center constantly struggles the balance between standardization for resource optimization and flexibility for business competitiveness. With the ever-growing demand of computing power, hyperscale data centers have faced challenges to deliver a highly versatile solution optimized for cost and performance while maintaining the flexibility and openness based on the commercial off the shelf (COTS) standard.
Supermicro’s MegaDC and CloudDC product families are the answer to the challenge. MegaDC and CloudDC are the key solutions for your next-generation hyperscale data center. With extended support of open standards including OpenBMC for version control, AIOM modules that support the OCP3.0 SFF standard, and power-optimized design, data center operators can enjoy the benefit of an open compute concept without revamping their existing infrastructure.
OCP Technology Overview
OCP (Open Compute Project) is an open-design architecture aiming to redesign everything from the data center down to the server to improve energy efficiency, power management, and ease of serviceability. Facebook has designed data centers that do not require AC cooling and rely solely on free air cooling. Although the value of revamping the data center to be OCP-centric is obvious, data center operators often debate the ROI of redesign everything.
Over the years, Supermicro has heard from its customers and continues to innovate on system design for hyperscale deployment. Supermicro's AIOM, with its OCP3.0 compliance and improved mechanical design makes servicing and maintenance easy, as opening the chassis for service and/or replacement is no longer required.
Platforms supporting AIOM/OCP 3.0 can offer better thermal control, resulting in lower cooling costs with a wide range of networking options in a small form factor, making it simple for deployment and easy to manage and service, with thermally-efficient components.
Supermicro Open Computing Solution Advantages
By leveraging OCP 3.0 design concepts, Supermicro is implementing AIOM into its architecture to offer an of-the-shelf standard solution with improved architecture:
- Thermal Improvement:
- Because AIOM cards are designed to be installed at the same level as the motherboard (see diagram below), versus the traditional PCI-E which is installed vertically or horizontally on top of the motherboard, AIOM significantly increases the airflow throughout the system, therefore improving thermal management.
- Easy serviceability:
- Because the AIOM card is installed from the rear of the chassis (see diagram below), versus the traditional PCI-E card that is installed from the top, the opening of the chassis top cover is no longer needed to install or remove the AIOM card. With the combination of the pull tab and screw knob, it eliminates the need for tools for service.
- TCO Optimization:
- With its SFF (Small Form-Factor), thermal efficiency, easy serviceability and implementation of OpenBMC, Supermicro is offering a solution that decreases time to service and minimizes system down time. By adapting a solution with AIOM from the server to the rack and to the data center level, as the infrastructure grows the improvement to TCO will grow together.