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PRESS RELEASE

Supermicro's Seventh Annual Open Storage Summit Brings Together 21 Ecosystem Partners to Share Practical Guidance on Deploying Enterprise AI at Scale

  • 12-session virtual event explores AI inference, agentic AI, cloud storage, and data management for production AI deployments
  • 38 industry experts from 21 leading technology companies including AMD, DDN, Hammerspace, IBM, Intel, KIOXIA, MinIO, Nutanix, Scality, Solidigm, VAST Data, Western Digital, Crusoe, Iron Mountain and others, share practical guidance for scalable, cost-efficient AI infrastructure
  • Presented with theCUBE, the summit runs August 11 through September 3 and is available live and on demand
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PRESS RELEASE

Supermicro Expands DCBBS with Precision-Engineered AI Rack Series to Accelerate Deployment and Time-to-Online

  • Industry-leading quality, factory pre-assembly, and modular design facilitate rapid integration of systems and liquid cooling components, shortening Time-to-Online (TTO)
  • Ten Rack models available in 44OU, 48U, 48OU, and 52U configurations for same-day data center integration to support a wide range of deployments
  • Certified for up to over 5500 lb./2,500 kg static load capacity to maximize compute power per rack, enabling higher compute densities and optimal space utilization
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PRESS RELEASE

Supermicro Introduces New Server Portfolio with 6th Gen AMD EPYC™ 9006 Series CPUs, Delivering 1.7x Generational Performance Improvements

  • 33% more cores, 2X PCIe Bandwidth and 2.6X higher memory bandwidth supercharge high-performance workloads
  • Powered by 6th Gen AMD EPYC CPUs and AMD Instinct™ GPUs, comprehensive rack-scale systems, built on DCBBS architecture, are optimized for Cloud, Enterprise, Storage, HPC and AI workloads
  • Industry’s broadest portfolio also includes the 72-GPU AMD Helios Platform, designed for large-scale AI training and high-throughput inference
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PRESS RELEASE

Supermicro Expands End-to-End DCBBS Liquid Cooling Portfolio with Rear Door Heat Exchangers for High-Density AI and HPC Infrastructure

  • Expanded ten-model portfolio supports cooling chill door capacities from 10kW up to 120kW for systems level to rack-scale AI factories
  • Flexible Rear Door Heat Exchangers deliver rapid, low-disruption liquid cooling for both new and legacy data centers
  • Integrated DCBBS deliver validated rack-scale infrastructure, intelligent management software, and global deployment services
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PRESS RELEASE

Supermicro Broadens AI at the Edge Solutions Portfolio with Intel-Powered Platforms Optimized for Low-Latency Inference and Industrial Deployments

  • Accelerate Edge AI Adoption with Low-Latency, Power-Efficient Systems Optimized for Retail, Manufacturing, Security, and Logistics
  • Deploy Larger AI Models at the Edge with Up to 32GB VRAM, Multi-GPU Scalability, and High-Bandwidth Memory Architectures
  • Flexible Portfolio Combines Integrated NPUs, Discrete GPU Acceleration, and Compact Form Factors to Reduce TCO and Simplify AI Deployment
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PRESS RELEASE

Supermicro Delivers NVIDIA Vera Rubin NVL4 End-to-End DCBBS Blueprint with Native FP64 Performance for Converged HPC and AI Infrastructure

  • Total solution includes up to 1,152 NVIDIA Rubin GPUs and 576 NVIDIA Vera CPUs in liquid-cooled racks—3.2MW Scalable Unit delivers next-generation performance for AI workloads and FP64 simulation, scalable to research clusters of any size
  • DLC-2 Direct Liquid Cooling supports 362 kW per rack with 3x in-row CDUs per Scalable Unit plus cold plates, manifolds, and SMC PG25-A ultra-high electrical impedance coolant
  • End-to-end solution accelerates AI and HPC infrastructure buildout for scientific research starting with project planning and site survey, through manufacturing and testing, to on-site deployment
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PRESS RELEASE

Supermicro Announces Proposed $7.0 Billion of Equity and Equity-linked Financing Transactions To Fund AI Orders

SAN JOSE, Calif., June 9, 2026 - (BUSINESS WIRE) -- Super Micro Computer, Inc. (NASDAQ: SMCI) (“Supermicro” or the “Company”), a Total IT Solution Manufacturer for AI, Cloud, Storage, and 5G/Edge, today announced a series of concurrent equity and equity-linked financing transactions ‎totaling $7.0 billion, in expected aggregate amount, as part of its plan to fund the purchase of components to satisfy the AI orders that the Company has received in recent weeks for its advanced AI servers.
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PRESS RELEASE

Supermicro Collaborates with Arm to Deliver a New Class of Energy-Efficient Rack-Scale Infrastructure for Enterprise Agentic AI

  • Arm AGI CPU is designed for maximum efficiency in agentic AI workload orchestration
  • Supermicro rack-scale Arm AGI CPU designs increase agentic AI compute performance density within any power envelope
  • Supermicro’s DCBBS capabilities and global manufacturing footprint reduce time-to-online (TTO) for large-scale AI infrastructure deployments
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