Displaying 1 - 10 of 287
PRESS RELEASE

Supermicro Expands End-to-End DCBBS Liquid Cooling Portfolio with Rear Door Heat Exchangers for High-Density AI and HPC Infrastructure

  • Expanded ten-model portfolio supports cooling chill door capacities from 10kW up to 120kW for systems level to rack-scale AI factories
  • Flexible Rear Door Heat Exchangers deliver rapid, low-disruption liquid cooling for both new and legacy data centers
  • Integrated DCBBS deliver validated rack-scale infrastructure, intelligent management software, and global deployment services
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PRESS RELEASE

Supermicro Broadens AI at the Edge Solutions Portfolio with Intel-Powered Platforms Optimized for Low-Latency Inference and Industrial Deployments

  • Accelerate Edge AI Adoption with Low-Latency, Power-Efficient Systems Optimized for Retail, Manufacturing, Security, and Logistics
  • Deploy Larger AI Models at the Edge with Up to 32GB VRAM, Multi-GPU Scalability, and High-Bandwidth Memory Architectures
  • Flexible Portfolio Combines Integrated NPUs, Discrete GPU Acceleration, and Compact Form Factors to Reduce TCO and Simplify AI Deployment
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PRESS RELEASE

Supermicro Delivers NVIDIA Vera Rubin NVL4 End-to-End DCBBS Blueprint with Native FP64 Performance for Converged HPC and AI Infrastructure

  • Total solution includes up to 1,152 NVIDIA Rubin GPUs and 576 NVIDIA Vera CPUs in liquid-cooled racks—3.2MW Scalable Unit delivers next-generation performance for AI workloads and FP64 simulation, scalable to research clusters of any size
  • DLC-2 Direct Liquid Cooling supports 362 kW per rack with 3x in-row CDUs per Scalable Unit plus cold plates, manifolds, and SMC PG25-A ultra-high electrical impedance coolant
  • End-to-end solution accelerates AI and HPC infrastructure buildout for scientific research starting with project planning and site survey, through manufacturing and testing, to on-site deployment
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PRESS RELEASE

Supermicro Announces Proposed $7.0 Billion of Equity and Equity-linked Financing Transactions To Fund AI Orders

SAN JOSE, Calif., June 9, 2026 - (BUSINESS WIRE) -- Super Micro Computer, Inc. (NASDAQ: SMCI) (“Supermicro” or the “Company”), a Total IT Solution Manufacturer for AI, Cloud, Storage, and 5G/Edge, today announced a series of concurrent equity and equity-linked financing transactions ‎totaling $7.0 billion, in expected aggregate amount, as part of its plan to fund the purchase of components to satisfy the AI orders that the Company has received in recent weeks for its advanced AI servers.
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PRESS RELEASE

Supermicro Collaborates with Arm to Deliver a New Class of Energy-Efficient Rack-Scale Infrastructure for Enterprise Agentic AI

  • Arm AGI CPU is designed for maximum efficiency in agentic AI workload orchestration
  • Supermicro rack-scale Arm AGI CPU designs increase agentic AI compute performance density within any power envelope
  • Supermicro’s DCBBS capabilities and global manufacturing footprint reduce time-to-online (TTO) for large-scale AI infrastructure deployments
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PRESS RELEASE

Supermicro Expands Rack-Scale AI Leadership with AMD Helios Platform, Accelerating Deployment and Operational Efficiency

  • Next –generation Supermicro AMD Helios platform to be showcased at Computex
  • Rack-scale DCBBS architecture enables rapid deployment and seamless scaling from single racks to hyperscale AI clusters
  • 72-GPU double-width Helios rack powered by AMD Instinct™ MI455X GPUs delivers exceptional performance for large-scale AI training and inference workloads
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PRESS RELEASE

Supermicro Introduces DCBBS Blueprints for NVIDIA Vera Rubin NVL72 and NVIDIA HGX™ Rubin NVL8, Built to Scale from 5MW to 1GW as an End-to-End Total Solution

  • End-to-End Blueprint Scalable from a 5MW to 1GW Power Envelope with full facility-side infrastructure for either single-tenant or multi-tenant deployments
  • DLC-2 Direct Liquid Cooling: engineered for near total heat capture, power efficiency, and lower noise with full stack integration of cold plates, CDUs, manifolds, rear door heat exchangers, cooling towers, and SMC PG25-A ultra-high electrical impeda
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PRESS RELEASE

Supermicro Launches New Server Solutions with Intel Xeon 6+ Processors to Reduce TCO and Accelerate Time-to-Online for Large-Scale Cloud and Data Centers

  • 12 new systems across Hyper, SuperBlade®, FlexTwin™, and GrandTwin® families offer industry-leading core density with up to 576 efficiency cores per server
  • Breakthrough performance-per-watt and energy efficiency designed to lower TCO and reduce power consumption in high-density cloud and enterprise environments
  • Optimized for cloud-native, virtualization, 5G analytics, content delivery, and throughput-intensive workloads
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