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Embedded / IoT Boards

Supermicro の高度な自社設計の優位性は、お客様の IoT と組込みコンピューティングのニーズに答えます

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Intel® Xeon® Processor D-2173IT(2)
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Intel® Xeon® processor E3-1585L v5(2)
Intel® Xeon® Processor E5-1600 v3(2)
Intel® Xeon® Processor E5-1600 v4(2)
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Intel® Xeon® processor E5-2600 v4(2)
Intel® Xeon® processor E7-4800 series(1)
Intel® Xeon® processor E7-4800 v2(1)
Intel® Xeon® processor E7-4800 v3(3)
Intel® Xeon® processor E7-4800 v4(3)
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Intel® Xeon® W-3300 Processor(1)
Intel® Xeon® W-3400/W-2400 Processors(2)

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Chipset

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Memory Slots

96 Slots(1)
64 Slots(1)
48 Slots(4)
32 Slots(31)
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1 Slot(17)

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DDR5-5600MHz(33)
DDR5-5200MHz (OC)(3)
DDR5-5200MHz(1)
DDR5-4800MHz(31)
DDR5-4400MHz(17)
DDR4-4133+MHz (OC)(1)
DDR4-3866+MHz (OC)(3)
DDR4-3200MHz (OC)(2)
DDR4-3200MHz(99)
DDR4-2933MHz(80)
DDR4-2666MHz(50)
DDR4-2400MHz(70)
DDR4-2133MHz(60)
DDR4-1866MHz(7)
DDR3-MHz(2)
DDR3-1866MHz(15)
DDR3-1600MHz(25)
DDR3-1333MHz(3)
DDR3 1600/1333/1066 MHz(1)

Special Features

Global SKU(24)

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X13SWA-TF

Key Features

Intel® Xeon® W-3400 series and Xeon® W-2400 series processors, Up to 350W TDP
Intel® W790
Up to 4TB(W-3400)/2TB(W-2400) 3DS ECC RDIMM, 1TB(W-3400)/512GB(W-2400) ECC RDIMM; DDR5-4800MT/s(1DPC)/ 4400MT/s(2DPC), in 16 DIMM slots
2 U.2 PCIe 3.0 for NVMe 2.5" SSD drives (U.2-1, U.2-2)
Xeon® W-3400 Series Processors: 6 PCIe 5.0 x16 Slots, support up to 6 Single Width/4 Double Width/2 Triple Width GPU cards Xeon® W-2400 Series Processors:3 PCIe 5.0 x16 Slots, support up to 3 Single Width/3 Double Width/2 Triple Width GPU cards (slot 3/5/7)
M.2 Interface: 4 PCIe 5.0 x4
M.2 Form Factor: 2280/22110
M.2 Key: M-Socket (w/o heat sink)
1GbE LAN port with Intel® Ethernet Controller I210-AT
10GbE LAN with Marvell AQC113C
8 SATA 3 (6Gb, RAID 0, 1, 5, 10)
Overclocking Supported (optional)
IPMI Supported

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X13SRN-H-WOHS

Key Features

Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
Fast AI hardware acceleration
4 independent display with 4K resolution
First performance hybrid architecture from Intel
Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
High speed connectivity through dual 2.5GbE
Hailo-8™ powerful and efficient Edge AI solution integration ready
Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
12-24V wide range power with RVP and TVS
100% wide temp grade design and components applied

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X13SRN-H

Key Features

Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
Fast AI hardware acceleration
4 independent display with 4K resolution
First performance hybrid architecture from Intel
Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
High speed connectivity through dual 2.5GbE
Hailo-8™ powerful and efficient Edge AI solution integration ready
Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
12-24V wide range power with RVP and TVS
100% wide temp grade design and components applied

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X13SRN-E-WOHS

Key Features

Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
Fast AI hardware acceleration
4 independent display with 4K resolution
First performance hybrid architecture from Intel
Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
High speed connectivity through dual 2.5GbE
Hailo-8™ powerful and efficient Edge AI solution integration ready
Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
12-24V wide range power with RVP and TVS
100% wide temp grade design and components applied

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X13SRN-E

Key Features

Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
Fast AI hardware acceleration
4 independent display with 4K resolution
First performance hybrid architecture from Intel
Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
High speed connectivity through dual 2.5GbE
Hailo-8™ powerful and efficient Edge AI solution integration ready
Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
12-24V wide range power with RVP and TVS
100% wide temp grade design and components applied

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X13SRA-TF

Key Features

Intel® Xeon® W-3400 series and Xeon® W-2400 series processors, TDP up to 350W
Intel® W790
Up to 2TB RDIMM 3DS, 512GB ECC RDIMM; DDR5-4800MT/s (1DPC)/4400MT/s (2DPC), in 8 DIMM slots
M.2 Interface: 2 PCIe 5.0 x4
M.2 Form Factor: 2280/22110
M.2 Key: M-Socket (w/o heat sink)
3 PCIe 5.0 x16 Slots, support up to 3 Single Width/2 Double Width/2 Triple Width GPU cards
1 PCIe 4.0 x4 Slots
1GbE LAN port with Intel® Ethernet Controller I210-AT
10GbE LAN with Marvell AQC113
6 SATA 3 (6Gb, RAID 0, 1, 5, 10)
Overclocking Supported (optional)
IPMI Supported

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X13SEW-TF

Key Features

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
10 NVMe ports PCIe 5.0 x8 via 5 MCIO connectors
1 PCIe 5.0 x8 ( in x16)
1 PCIe 5.0 x32
M.2 Interface: 1 PCIe 3.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
Dual LAN with 10GBase-T with Intel® X550
Intel® C741 controller for 10 SATA3 (6 Gbps) ports
4 USB 3.2 Gen1 (2 rear, 2 via header), 3 USB 2.0 (2 rear, 1 via Type-A)
I/O: 1 VGA, 2 COM, 1 TPM header
2 SuperDOM with built-in power

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X13SEW-F

Key Features

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
10 NVMe ports PCIe 5.0 x8 via 5 MCIO connectors
1 PCIe 5.0 x8 ( in x16)
1 PCIe 5.0 x32
M.2 Interface: 1 PCIe 3.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
Dual LAN with 1GbE with Intel® I210
Intel® C741 controller for 10 SATA3 (6 Gbps) ports
4 USB 3.2 Gen1 (2 rear, 2 via header), 3 USB 2.0 (2 rear, 1 via Type-A)
I/O: 1 VGA, 2 COM, 1 TPM header
2 SuperDOM with built-in power

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X13SEVR-SP13F

Key Features

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 225W TDP
Intel C741® Chipset
Up to 2TB ECC RDIMM/RDIMM 3DS, DDR5-5600MT/s in 8 DIMM slots
2 PCIe 5.0 x8 MCIO connector, support riser card: RSC-S-68G5 for FHHL PCIe card
4 SMA for 1PPS & 10MHz (two Input two Output), 1x SMA for GNSS input with onboard GNSS module
1 COM header;1 VGA header; 2 USB 3.2 Gen1 Ports
M.2 Interface: 1 PCI-E 4.0 x4, M.2 Form Factor: 2280
12 SFP28 for 25GbE Ethernet and 1 IPMI shared LAN with Intel® Ethernet Controller E810-CAM1, 1 RJ45 for Gigabit Ethernet and IPMI shared LAN with Intel® Ethernet Controller I210-AT, Note that only port10 support E810 NC-SI function
IEEE1588 v2 & Synchronous Ethernet support, DPLL/OCXO design, Up to 8 hours hold-over

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X13SET-PT

Key Features

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 300W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
1 PCIe 5.0 x16 Proprietary Storage adapter Slot
1 PCIe 5.0 x16 Right Riser Slot
1 PCIe 5.0 x16 Left Riser Slot
Dual LAN with 10G SFP+_x000D_
1 VGA, 1 COM, TPM header
Intel® C741 controller for 6 SATA3 (6 Gbps) ports; RAID 0,1,5,10
M.2 Interface: 2 PCIe 5.0x4 M.2 Form Factor: 2280,22110 M.2 Key: M-Key

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X13SET-GC

Key Features

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) or DDR5-4400MT/s (2DPC) in 16 DIMM slots
4 PCIe 5.0 X8 via MCIO connectors
2 PCIe 5.0 x16 via Molex Impleplus connectors
1 PCIe 5.0 x8 via customized 124-pin slim cool edge connector(for front I/O module)
Boardcom 3808 controller for 6 SAS3 drives
M.2 Interface: 2 PCIe 3.0x4&SATA M.2 Form Factor: 2280 M.2 Key: M-Key
I/O: 1 COM, TPM header

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X13SET-G

Key Features

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) or DDR5-4400MT/s (2DPC) in 16 DIMM slots
4 PCIe 5.0 X8 via MCIO connectors
2 PCIe 5.0 x16 via Molex Impleplus connectors
1 PCIe 5.0 x8 via customized 124-pin slim cool edge connector(for front I/O module)
M.2 Interface: 2 PCIe 3.0x4&SATA M.2 Form Factor: 2280 M.2 Key: M-Key
I/O: 1 COM, TPM header

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X13SEM-TF

Key Features

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
1 PCIe 5.0 x8,
2 PCIe 5.0 x16,
4 PCIe 5.0 x8 MCIO connectors
M.2 Interface: 2 PCIe 4.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
8 NVMe ports PCI-E 5.0 x4 via 4 MCIO connectors
Dual LAN with 10GBase-T with Intel® X550
Intel® C741 controller for 10 SATA3 (6 Gbps) ports or 2 PCI-E 3.0 x4 NVMe + 2 SATA3 ports; RAID (SATA) 0,1,5,10
5 USB 3.2 Gen1 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)

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X13SEM-F

Key Features

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
1 PCIe 5.0 x8,
2 PCIe 5.0 x16,
4 PCIe 5.0 x8 MCIO connectors
M.2 Interface: 2 PCIe 4.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
8 NVMe ports PCI-E 5.0 x4 via 4 MCIO connectors
Dual LAN with 1GbE with Intel® I350
Intel® C741 controller for 10 SATA3 (6 Gbps) ports or 2 PCI-E 3.0 x4 NVMe + 2 SATA3 ports; RAID (SATA) 0,1,5,10
5 USB 3.2 Gen1 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)

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X13SEI-TF

Key Features

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
3 PCIe 5.0 x8,
2 PCIe 5.0 x16,
M.2 Interface: 2 PCIe 5.0 x4
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs
Dual LAN with 10GbE with Intel® X550
Intel® C741 controller for 10 SATA3 (6 Gbps) ports
4 USB 3.2 Gen1 (2 rear, 1 Type-A, 1 via header), 2 USB 2.0 (2 rear)

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X13SEI-F

Key Features

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
3 PCIe 5.0 x8,
2 PCIe 5.0 x16,
M.2 Interface: 2 PCIe 5.0 x4
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs
Dual LAN with 1GbE with Intel® I210
Intel® C741 controller for 10 SATA3 (6 Gbps) ports
4 USB 3.2 Gen1 (2 rear, 1 Type-A, 1 via header), 2 USB 2.0 (2 rear)

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X13SEFR-A

Key Features

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) or DDR5-4400MT/s (2DPC) in 16 DIMM slots
5 PCIe 5.0 x8 via MCIO connectors
1 PCIe 5.0 x16 AIOM slot
1 PCIe 5.0 x16
AIOM for LAN
M.2 Interface: 2 PCIe 3.0x2&SATA M.2 Form Factor: 2280,22110 M.2 Key: M-Key
I/O: 1 VGA, 1 COM, TPM header

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X13SEED-SF

Key Features

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB ECC RDIMM/RDIMM 3DS, DDR5-5600MT/s in 8 DIMM slots
1 PCIe 5.0 x16 Right Riser Slot, support LP PCIe card
2 PCIe 5.0 x16 Left Riser Slot, support FHHL PCIe card
1 SFP for Gigabit Ethernet and IPMI shared LAN with Intel® Ethernet Controller I210-IS
1 VGA Port; 2 USB 2.0 Ports; 1 Serial Port via KVM Connector.
M.2 Interface: 2 PCI-E 5.0 x4, M.2 Form Factor: 2280/22110

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