X13DAI-T

Workstation

Key Features


  1. Support CXL
  2. 5th/4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP
  3. Intel® C741 Chipset
  4. Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s(1DPC) in 16 DIMM slots
  5. Broadcom BCM57416 Dual ports 10G LAN
  6. 2 SATA DOM ports
  7. 2 M.2
  8. 4 NVMe ports PCIe 5.0 x4 via 2 MCIO connectors
  9. 5 PCIe 5.0 x16
  10. 1 PCIe 5.0 x8
  11. 8 SATA 3.0 ports(C741, RAID 0, 1, 5, 10)
  12. HD Audio 7.1 channel
  13. 1 USB 3.1 Gen 2, 6 USB 3.0
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-X13DAI-T
Physical Stats
Form Factor
  • EATX
Dimension
  • 12.1" x 13.1" (30.734cm x 33.274cm)
Processor
CPU
Core
  • Up to 64 cores
System Memory
Memory Capacity
  • 16 DIMM slots
  • Up to 4TB 3DS ECC RDIMM, DDR5-5600MHz
Memory Type
  • 5600/4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS) 256GB 5600MT/s
DIMM Sizes
  • 16GB, 32GB, 64GB, 96GB, 128GB, 256GB
  • RDIMM: Up to 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • Intel® C741
SATA
  • 8 SATA3 ports; RAID 0, 1, 5, 10
  • 2 SATA3 ports; RAID 0,1
Network Controllers
  • N/A
Expansion Slots
PCIe
  • 1 PCIe 5.0 x8,
  • 5 PCIe 5.0 x16
M.2
  • M.2 Interface: 2 PCIe 5.0 x4
  • Form Factor: 2280/22110
  • Key: M-Key
System BIOS
BIOS Type
  • AMI 32MB AMI UEFI
BIOS Features
  • ACPI 6.4
  • SMBIOS 2.8/3.5
  • UEFI 2.8A
  • Plug and Play (PnP)
  • PCI FW 3.2
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
FAN
  • 13x 4-pin fan headers (up to 13 fans)
Operating Environment
Operating Temperature Range
  • 10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range
  • -40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range
  • 8% - 90% (non-condensing)
Non Operating Relative Humidity Range
  • 5% - 95% (non-condensing)
Resources
Parts List
X13DAI-T