Supermicro Brings Enterprise-Class AI Performance to the Client, Edge, and Consumer Markets
Expands edge portfolios with NVIDIA, Intel, and AMD-powered platforms
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Supermicro Announces Support for Upcoming NVIDIA Vera Rubin NVL72, HGX Rubin NVL8 and Expanded Rack-Scale Manufacturing Capacity for Liquid-Cooled AI Solutions
Data Center Building Block Solutions® (DCBBS) and Advanced Direct Liquid Cooling
(DLC) Technology with Supermicro US Based In-House Design/Manufacturing
Accelerate Time to Deployment of Next Generation Liquid-cooled AI Infrastructure
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How Supermicro Boosts Density in AI Data Centre Environments
Supermicro has launched a new 6U SuperBlade platform designed to increase compute density and efficiency for modern data centre environments
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Supermicro Unveils High-Density, Liquid-Cooled and Air-Cooled 6U SuperBlade® Powered by Intel® Xeon® 6900 Series Processors for Maximum Performance and Efficiency
- 6U SuperBlade's innovative design delivers up to 93% cable reduction and 50% space savings compared to traditional 1U servers
- 32-inch depth enclosure fits in a standard 19-inch rack, eliminating the need for a deep rack
- Supports both air cooling (6U 5 nodes) and liquid cooling (6U 10 nodes)
- Powered by dual Intel Xeon 6900 Series Processors with P-cores, the 6U SuperBlade delivers high compute density, supporting up to 100 servers per rack
- Optimized for demanding HPC and AI workloads including manufacturing, financial services, scientific research, energy and climate & weather modeling
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HPC and AI converging infrastructures
Vik Malyala, Managing Director & President for EMEA from Supermicro shares the boundaries between HPC and AI workloads becoming increasingly blurred
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Ethernet is a full-fledged alternative for AI networks
Dan Hanson, Director of AI Fabric Product Management at Supermicro talks about how training large AI models requires GPU interconnects with extremely low latency and high throughput.
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Supermicro Expands NVIDIA Blackwell Portfolio with New 4U and 2-OU (OCP) Liquid-Cooled NVIDIA HGX B300 Solutions Ready for High-Volume Shipment
- Introducing 4U and 2-OU (OCP) liquid-cooled NVIDIA HGX B300 systems for high-density hyperscale and AI factory deployments, supported by Supermicro Data Center Building Block Solutions® with DLC-2 and DLC technology, respectively
- 4U liquid-cooled NVIDIA HGX B300 systems designed for standard 19-inch EIA racks with up to 64 GPUs per rack, capturing up to 98% of system heat through DLC-2 (Direct Liquid-Cooling) technology
- Compact and power-efficient 2-OU (OCP) NVIDIA HGX B300 8-GPU system designed for 21-inch OCP Open Rack V3 (ORV3) specification with up to 144 GPUs in a single rack
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Storage priorities in the AI age
Wendell Wenjen from Supermicro highlights four current developments shaping storage strategies in AI-driven enterprise environments.
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Supermicro JumpStart Review: A Week With an NVIDIA HGX B200
Supermicro’s JumpStart program takes a very different approach to hardware evaluation. Instead of a short, scripted demo in a shared lab environment, JumpStart gives qualified customers free, time-boxed, bare-metal access to a catalog of real production servers.
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Supermicro JumpStart Review: A Week With an NVIDIA HGX B200
Supermicro is already offering access to HGX B200- and B300-class systems for AI training and inference, and it uses JumpStart to give early, NDA-based looks at next-generation platforms that are not yet broadly shipping.
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