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Supermicro Global SKU logo

Supermicro® Global SKU Program

Accelerated Deployment, Support and Service Worldwide

Supermicro's Global SKU Program offers streamlined fulfillment and support services for our premier lines of advanced server, storage and networking solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded applications. As the one-stop-shop for all customer system building needs, Supermicro is committed to providing maximum flexibility to design and deploy highly-efficient, high-performance computing solutions for any scale customer requirement to any location around the globe.

Supermicro Global SKUs offer the following advantages:

  • Easy identification of Systems, Motherboards and Chassis selected for their outstanding performance, popularity and preference for building highly optimized server solutions
  • Rapid integration and distribution through Supermicro's advanced operations centers in the US (San Jose, CA HQ), Taiwan and the Netherlands serving the Americas, Asia-Pacific (APAC), Europe, Middle East and Africa (EMEA) regions
  • Strategic inventory control ensuring high-volume availability providing reduced lead-time, lowered inventory overhead at your facilities, rapid deployment and overall TTM advantages
  • Additional cost savings through reduced shipping charges and dedicated support within local time zones through streamlined integration, fulfillment and support at worldwide logistics and service centers
  • Global Services for Next Business Day or 4 HOURS technical response and onsite service

In addition, look for the Global SKU icon Mini Global SKU icon designation on selected products across our website.

At Supermicro, we are committed to supporting our customers with the highest quality products, support and service.

Systems
SKUForm Factor# of Nodes# of CPUCPU TypeChipsetSystem MemoryStorageNetworkingPower Supply
SYS-110P-FDWTR1U11
  • 3rd Gen Intel® Xeon® Scalable processors
  • Single Socket LGA-4189 (Socket P+) supported
  • TDP up to 205W;
Intel® C621A
  • 8 DIMM slots
  • Up to 2TB ECC RDIMM/LRDIMM, DDR4-3200MHz
  • 2x 2.5" SATA drive bays;
2x 10GbE RJ45 port(s)600W DC Redundant PSU
SYS-110P-WTR1U11
  • Support Intel® 3rd Gen Xeon® Scalable Processors
  • Single Socket LGA 4189 (Socket P+) supported
  • TDP up to 270W;
Intel® C621A
  • 8 DIMM slots
  • Intel® DCPMM, DDR4-3200MHz
  • ECC LRDIMM, DDR4-3200MHz
  • ECC RDIMM, DDR4-3200MHz
  • 10x 2.5" SATA drive bays; 4x 2.5" NVMe hybrid;
2x 10GbE RJ45 port(s) with Intel® Ethernet Controller X550Redundant 750W Platinum level (94%)
SYS-120C-TN10R1U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 16 DIMM slots
  • Up to 4 TB Intel® DCPMM, DDR4-3200MHz
  • Up to 4 TB ECC LRDIMM, DDR4-3200MHz
  • Up to 4 TB ECC RDIMM, DDR4-3200MHz
  • 10x 2.5" hot-swap NVMe/SATA/SAS hybrid drive bays;
  • Optional RAID support via RAID controller AOC
via AIOMRedundant 860W Platinum level (94%)
SYS-120H-TNR1U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 32 DIMM slots
  • Up to 8TB Intel® DCPMM, DDR4-3200MHz
  • Up to 8TB ECC LRDIMM, DDR4-3200MHz
  • Up to 8TB ECC RDIMM, DDR4-3200MHz
  • 8x 2.5" hot-swap NVMe/SATA/SAS drive bays; 8x 2.5" NVMe hybrid;
  • Optional RAID support via RAID Controller AOC
2x 100GbE QSFP28 with Broadcom® BCM57508 (optional); 2x 10GbE RJ45 with Intel® X550-AT2 (optional); 2x 10GbE SFP+ with Intel® X710-BM2 (optional); 2x 1GbE RJ45 with Intel® i350-AM2 (optional); 2x 25GbE SFP28 with Broadcom® BCM57414 (optional); 4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional); 4x 10GbE SFP+ with Intel® XL710-BM1 (optional); 4x 1GbE SFP or 4x 1GbE RJ45 with Intel® i350-AM4 (optional); 4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional) via AIOMRedundant 1200W Titanium level (96%)
SYS-120U-TNR1U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 12x 2.5" hot-swap NVMe/SATA/SAS drive bays; 12x 2.5" NVMe hybrid;
  • Optional RAID support via RAID controller AOC
2x 10GbE RJ45 and 2x 10GbE SFP+ with Intel® X710-TM4 (optional); 2x 10GbE RJ45 with Intel® X710-AT2 (optional)Redundant 1200W Titanium level (96%)
SYS-210P-FRDN6T2U11
  • 3rd Gen Intel® Xeon® Scalable processors
  • Single Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W;
Intel® C621A
  • 8 DIMM slots
  • Up to 2TB ECC LRDIMM, DDR4-3200MHz
  • Up to 2TB ECC RDIMM, DDR4-3200MHz
  • 2x 2.5" hot-swap SATA drive bays;
2x 1/10GbE and 4x 1GbE port(s)600W DC Redundant PSU
SYS-220BT-HNC8R2U42
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA 4189 (Socket P+) supported
  • TDP up to 205W;
Intel® C621A
  • 16 DIMM slots (16 DRAM + 4 PMem)
  • UP to 4TB: 16x 256GB DRAM
  • UP to 6TB: 8x 256GB DRAM and 8x 512GB Intel® Optane™ Persistent Memory
  • 6x 2.5" hot-swap NVMe/SATA/SAS drive bays; 6x 2.5" NVMe hybrid;
  • Optional HBA support via SAS3808 Adapter
via AIOMRedundant 2600W Titanium level (96%)
SYS-220BT-HNTR2U42
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA 4189 (Socket P+) supported
  • TDP up to 205W;
Intel® C621A
  • 16 DIMM slots (16 DRAM + 4 PMem)
  • UP to 4TB: 16x 256GB DRAM
  • UP to 6TB: 8x 256GB DRAM and 8x 512GB Intel® Optane™ Persistent Memory
  • 6x 2.5" hot-swap NVMe/SATA drive bays; 6x 2.5" NVMe hybrid;
  • Optional RAID support via Intel® PCH
via AIOMRedundant 2600W Titanium level (96%)
SYS-220H-TN24R2U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 32 DIMM slots
  • Up to 8TB Intel® DCPMM, DDR4-3200MHz
  • Up to 8TB ECC LRDIMM, DDR4-3200MHz
  • Up to 8TB ECC RDIMM, DDR4-3200MHz
  • 24x 2.5" hot-swap NVMe/SATA/SAS drive bays;
  • Optional RAID support via RAID Controller AOC
2x 100GbE QSFP28 with Broadcom® BCM57508 (optional); 2x 10GbE RJ45 with Intel® X550-AT2 (optional); 2x 10GbE SFP+ with Intel® X710-BM2 (optional); 2x 1GbE RJ45 with Intel® i350-AM2 (optional); 2x 25GbE SFP28 with Broadcom® BCM57414 (optional); 4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional); 4x 10GbE SFP+ with Intel® XL710-BM1 (optional); 4x 1GbE SFP or 4x 1GbE RJ45 with Intel® i350-AM4 (optional); 4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional) via AIOMRedundant 1600W Titanium level (96%)
SYS-220H-TNR2U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 32 DIMM slots
  • Up to 8TB Intel® DCPMM, DDR4-3200MHz
  • Up to 8TB ECC LRDIMM, DDR4-3200MHz
  • Up to 8TB ECC RDIMM, DDR4-3200MHz
  • 8x 2.5" hot-swap NVMe/SATA/SAS drive bays;
  • Optional RAID support via RAID Controller AOC
2x 100GbE QSFP28 with Broadcom® BCM57508 (optional); 2x 10GbE RJ45 with Intel® X550-AT2 (optional); 2x 10GbE SFP+ with Intel® X710-BM2 (optional); 2x 1GbE RJ45 with Intel® i350-AM2 (optional); 2x 25GbE SFP28 with Broadcom® BCM57414 (optional); 4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional); 4x 10GbE SFP+ with Intel® XL710-BM1 (optional); 4x 1GbE SFP or 4x 1GbE RJ45 with Intel® i350-AM4 (optional); 4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional) via AIOM
SYS-220HE-FTNRD2U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 32 DIMM slots
  • Up to 8TB Intel® DCPMM, DDR4-3200MHz
  • Up to 8TB ECC LRDIMM, DDR4-3200MHz
  • Up to 8TB ECC RDIMM, DDR4-3200MHz
  • 6x 2.5" hot-swap NVMe/SATA drive bays; 6x 2.5" NVMe hybrid;
  • Optional RAID support via RAID Controller AOC
2x 100GbE QSFP28 with Broadcom® BCM57508 (optional); 2x 10GbE RJ45 with Intel® X550-AT2 (optional); 2x 10GbE SFP+ with Intel® X710-BM2 (optional); 2x 1GbE RJ45 with Intel® i350-AM2 (optional); 2x 25GbE SFP28 with Broadcom® BCM57414 (optional); 4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional); 4x 10GbE SFP+ with Intel® XL710-BM1 (optional); 4x 1GbE SFP or 4x 1GbE RJ45 with Intel® i350-AM4 (optional); 4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional) via AIOM1300W -48Vdc single output power supply
SYS-420GP-TNR4U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 32 DIMM slots
  • Up to 8TB ECC LRDIMM, DDR4-3200MHz
  • 24x 2.5" hot-swap NVMe/SATA/SAS drive bays; 8x 2.5" NVMe dedicated;
2x 1GbE RJ45 port(s) with Intel® Ethernet Controller I350Redundant 2000W Titanium level (96%)
SYS-510P-MR1U11
  • Support Intel® 3rd Gen Xeon® Scalable Processors
  • Single Socket LGA 4189 (Socket P+) supported
  • TDP up to 220W;
Intel® C621A
  • 8 DIMM slots
  • Intel® DCPMM, DDR4-3200MHz
  • ECC LRDIMM, DDR4-3200MHz
  • ECC RDIMM, DDR4-3200MHz
  • 4x 3.5" NVMe/SATA drive bays; 4x 3.5" NVMe hybrid;
2x 1GbE RJ45 port(s) with Intel® Ethernet Controller i350Redundant 400W Platinum level (94%)
SYS-510P-WTR1U11
  • Support Intel® 3rd Gen Xeon® Scalable Processors
  • Single Socket LGA 4189 (Socket P+) supported
  • TDP up to 270W;
Intel® C621A
  • 8 DIMM slots
  • Intel® DCPMM, DDR4-3200MHz
  • ECC LRDIMM, DDR4-3200MHz
  • ECC RDIMM, DDR4-3200MHz
  • 4x 3.5" NVMe/SATA drive bays; 4x 3.5" NVMe hybrid;
2x 10GbE RJ45 port(s) with Intel® Ethernet Controller X550Redundant 500W Platinum level (94%)
SYS-610U-TNR1U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 4x 3.5" hot-swap NVMe/SATA/SAS drive bays; 4x 2.5" NVMe hybrid;
  • Optional RAID support via RAID controller AOC
2x 10GbE RJ45 and 2x 10GbE SFP+ with Intel® X710-TM4 (optional); 2x 10GbE RJ45 with Intel® X710-AT2 (optional)Redundant 1200W Titanium level (96%)
SYS-620C-TN12R2U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 16 DIMM slots
  • Up to 4 TB Intel® DCPMM, DDR4-3200MHz
  • Up to 4 TB ECC LRDIMM, DDR4-3200MHz
  • Up to 4 TB ECC RDIMM, DDR4-3200MHz
  • 12x 3.5" hot-swap NVMe/SATA/SAS hybrid drive bays;
  • Optional RAID support via RAID controller AOC
via AIOMRedundant 1200W Titanium level (96%)
SSG-620P-ACR12H2U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 16 DIMM slots
  • Up to 18TB Intel® DCPMM, DDR4-2666MHz
  • Up to 4TB ECC RDIMM/LRDIMM, DDR4-3200MHz
  • 12x 3.5" hot-swap SATA3/SAS3 drive bays; 4x 3.5" NVMe hybrid; 4x 2.5" NVMe hybrid;
  • Optional RAID support via RAID/HBA controller AOC
2x 10GbE RJ45 port(s) with Intel® Ethernet Controller X550Redundant 1200W Titanium level (96%)
SYS-620P-TRT2U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W;
Intel® C621A
  • 8x 3.5" hot-swap drive bays;
2x 10GbE port(s)Redundant 1200W Titanium level (96%)
SYS-620U-TNR2U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 12x 3.5" hot-swap NVMe/SATA/SAS drive bays; 12x 2.5" NVMe hybrid;
  • Optional RAID support via RAID controller AOC
2x 10GbE RJ45 and 2x 10GbE SFP+ with Intel® X710-TM4 (optional); 2x 10GbE RJ45 with Intel® X710-AT2 (optional)Redundant 1200W Titanium level (96%)
SSG-640P-E1CR36H4U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 16 DIMM slots
  • Up to 18TB Intel® DCPMM, DDR4-2666MHz
  • Up to 4TB ECC RDIMM/LRDIMM, DDR4-3200MHz
  • 36x 3.5" hot-swap SATA3/SAS3 drive bays; 4x 3.5" NVMe hybrid;
  • Optional RAID support via RAID/HBA controller AOC
2x 10GbE RJ45 port(s) with Intel® Ethernet Controller X5501600W Redundant Power Supplies with PMBus
SYS-740GP-TNRTFull-Tower12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 16 DIMM slots
  • Up to 4TB ECC LRDIMM, DDR4-3200MHz
  • 8x 3.5" hot-swap NVMe/SATA/SAS Support drive bays; 10x 2.5" NVMe dedicated;
2x 10GbE RJ45 port(s) with Intel® Ethernet Controller X550-AT22200W Titanium level (96%)
SYS-F610P2-RTN4U82
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 185W; 3 UPI
Intel® C621A
  • 16 DIMM slots
  • Up to 2TB RDIMM/LRDIMM, DDR4-3200MHz
  • Up to 4TB Intel® Optane™ Persistent Memory, DDR4-3200MHz
  • 6x 2.5" hot-swap NVMe/SATA/SAS drive bays; 6x 2.5" NVMe hybrid;
  • 6x 2.5" 7mm drive bays
1x 1GbE RJ45 (BMC) port(s) via AIOM2200W Titanium level (96%)
SYS-F620P3-RTBN4U42
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket LGA-4189 (Socket P+) supported
  • TDP up to 205W; 3 UPI
Intel® C621A
  • 16 DIMM slots
  • Up to 2TB RDIMM/LRDIMM, DDR4-3200MHz
  • Up to 4TB Intel® Optane™ Persistent Memory, DDR4-3200MHz
  • 8x 3.5" hot-swap SATA/SAS drive bays; 8x 2.5" NVMe hybrid;
  • 8x 2.5" 7mm drive bays
1x 1GbE RJ45 (BMC) port(s) via AIOM2200W Titanium level (96%)
AS -1014S-WTRT1U Rackmount 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm)11
  • Single AMD EPYC™ 7000-series Processor (up to 240W), AMD EPYC™ 7002 series and next generation processors
System on Chip (SoC)
  • Up to 2TB 3DS ECC RDIMM/LRDIMM; DDR4 up to 3200MHz, in 8 DIMM slots
  • 4 Hot-Swappable 3.5" SATA drive support; Optional 4 U.2 NVMe (PCIe Gen 3) drive support vs additional NVMe cables required
2 10GBase-T Ethernet via Broadcom BCM57416 Controller; 7 USB 3.0 ports (4 rear, 2 front, 1 Type A)500W Redundant Power Supplies Platinum Level (94%) (Full redundancy based on configuration and application load)
AS -1024US-TRT1U Chassis12
  • Dual AMD EPYC 7002/7003 series processor
System on Chip (SoC)
  • 32x DIMM slots, Up to 8TB ECC 3DS LRDIMM, Up to 3200 MHz
  • 4x hot-swap 3.5" drive bays support
Dual 10GBase-T RJ45 LAN ports via Intel Carlsville X710-AT2; 3 USB 3.0 ports (2 rear, 1 Type A)1000W Redundant Titanium Level (96%+) power supplies (Full redundancy based on configuration and application load)
AS -1114S-WTRT1U Rackmount 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm)11
  • Single AMD EPYC™ 7000-series Processor (up to 240W), AMD EPYC™ 7002 series and next generation processors
System on Chip (SoC)
  • Up to 2TB 3DS ECC RDIMM/LRDIMM; DDR4 up to 3200MHz, in 8 DIMM slots
  • 10 Hot-Swappable 2.5" SATA drive support; Optional 2 U.2 NVMe (PCIe Gen 3) drive support vs additional NVMe cables required
2 10GBase-T Ethernet via Broadcom BCM57416 Controller; 7 USB 3.0 ports (4 rear, 2 front, 1 Type A)500W Redundant Power Supplies Platinum Level (94%) (Full redundancy based on configuration and application load)
AS -4124GS-TNR17.2" x 7.0" x 29"12
  • Dual AMD EPYC™ 7003/7002 Series Processors
AMD EPYC™ 7002/7003 Series
  • 32DIMMs, up tp 8TB
  • Up to 24x 2.5" SAS/SATA drive bays 2x 2.5" SATA supported natively* 4x 2.5" NVMe supported natively RAID controller option available for 24 HDDs
2 RJ45 GbE LAN ports (rear) 1 RJ45 Dedicated IPMI LAN port2000W Redundant Power Supplies with PMBus Total Output Power 1000W: 100 – 127Vac 1800W: 200 – 220Vac 1980W: 220 – 230Vac 2000W: 230 – 240Vac 2000W: 220 – 240Vac (UL only) Dimension (W x H x L) 73.5 x 40 x 203 mm Input 100-127Vac / 12
SYS-1019P-WTR1U 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm)11
  • Intel® Xeon® Scalable Processors (Cascade Lake/Skylake).
  • Single Socket P (LGA 3647) supported, CPU TDP support 205W
Intel® C622 chipset
  • Up to Up to 384GB Registered ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
  • 10x 2.5" hot-swap SAS/SATA drive bay
Dual LAN with 10GBase-T with Intel® X722 + X557PWS-504P-1R
SYS-1029P-WTRT1U 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm)12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C622 chipset
  • Up to Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
  • 10x 2.5" hot-swap SATA3/SAS3 drive bays, 2x 2.5" hot-swap NVMe/SAS3/SATA3 hybrid drive bays
Dual 10GBaseT LAN ports, 1 dedicated IPMI port, 4 rear USB3.0 ports, 2 front USB 3.0 portsRedundant 700/750W high-efficiency (Platinum Level) power supply
SYS-1029U-TR41U Chassis12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
  • Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
  • 10 hot-swap 2.5" drive support
4 Gigabit Ethernet; 2 VGA ports (1 rear, 1 onboard) 5 USB 3.0 ports (2 rear, 2 front, 1 Type A); 1 Serial Port750W Redundant Platinum Level Power Supplies
SYS-2029TP-HTR2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.5”)42
Intel® C621 chipset
  • Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
  • Quad set of 6x 2.5” hot-swap SATA drive bays
Quad set of single IPMI 2.0 + KVM with dedicated LAN only. Need one network card installed per node2200W Redundant Titanium Level high-efficiency Power Supplies with I2C & PMBus
SYS-4029GP-TRT4U Rackmount12
  • Up to
  • 24 x 2.5" Hot-swap SATA/SAS drives
2x 10GBase-T ports; Intel® X540 10GBase-T2000W(2+2) Redundant Power Supplies Titanium Level (96%+)
SYS-5019A-FTN41U Short Depth Rackmount11
  • Intel® Atom™ Processor Denverton C3758, SoC, 8 Cores, 25W
System on Chip
  • Up to 256GB Registered ECC DDR4-2400MHz or 64GB Unbuffered ECC/Non-ECC DDR4-2400MHz; in 4 DIMM slots
  • 1x 3.5" or 4x 2.5" HDD
4x 1GbE LAN, 1x dedicated IPMI LAN, 2x USB 2.0200W Low Noise AC-DC power supply with PFC
SYS-5019C-WR1U 17.2" (437mm) x 1.7" (43mm) x 25.6" (650mm)11
  • 8th/9th Generation Intel® Core™i3/Pentium®/Celeron® Processor, Intel® Xeon® E-2100 Processor, Intel® Xeon® E-2200 Processor.
  • Single Socket LGA-1151 (Socket H4) supported, CPU TDP support Up to 95W TDP * 95W CPU support up to 30 degree ambient
Intel® C246 chipset
  • Up to Up to 128GB Unbuffered ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots
  • 4x 3.5" hot-swap drive bay
Dual LAN with Intel® Ethernet Controller I210-ATPWS-504P-1R
SYS-5019D-FN8TP1U Short Depth Rackmount11
  • Intel Skylake Xeon D-2146NT SoC, 2.3GHz, 8 Core, 80W
System On Chip
  • 4 x DDR4 DIMM 512 GB up to 2667MHz LRDIMM or 256GB RDIMM, ECC
  • 1x 3.5" or 4x 2.5"
2 x 10G SFP+, 2 x 10GbE LAN, 4x 1GbE LAN, 1x dedicated IPMI LAN, 2 USB 3.0200W Low Noise AC-DC power supply with PFC
SYS-5019P-M1U 17.2" (437mm) x 1.7" (43mm) x 19.85" (503mm)11
  • Intel® Xeon® Scalable Processors (Cascade Lake/Skylake).
  • Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 chipset
  • Up to Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
  • 4x 3.5" hot-swap SAS/SATA
Dual LAN with 1GbEPWS-350-1H
SYS-5019P-WTR1U 17.2" (437mm) x 1.7" (43mm) x 25.6" (650mm)11
  • Intel® Xeon® Scalable Processors (Cascade Lake/Skylake).
  • Single Socket P (LGA 3647) supported, CPU TDP support 205W
Intel® C622 chipset
  • Up to Up to 384GB Registered ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
  • 4x 3.5" hot-swap SAS/SATA
Dual LAN with 10GBase-T with Intel® X722 + X557PWS-504P-1R
SYS-6019P-MTR1U Rackmount 437 x 43 x 508mm (17.2” x 1.7” x 19.98”)12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
  • 4 Hot-Swap 3.5" SATA3 6Gb/s
2x 1GbE LAN Marvell 88E1512 PHY800W Redundant Power Supply, 80PLUS Platinum
SYS-6019P-WTR1U 17.2" (437mm) x 1.7" (43mm) x 25.6" (650mm)12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
  • 4x 3.5" hot-swap SATA3/SAS3 drive bays
Dual 1G LAN ports, 1 dedicated IPMI port, 4 rear USB 3.0 portsRedundant 700/750W High-efficiency (Platinum Level) power supply
SYS-6019U-TR41U Chassis12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
  • Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
  • 4 hot-swap 3.5" drive support
4 Gigabit Ethernet; 2 VGA ports (1 rear, 1 onboard) 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial PortRedundant 750W Platinum Level Power Supply
SSG-6029P-E1CR12H2U 17.2" (437mm) x 3.5" (89mm) x 25.5" (647mm)12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C622 chipset
  • Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
  • 12x 3.5" hot-swap SAS3/SATA3 drive bays
Dual LAN with 10GBase-T with Intel® X5571200W Titanium Level high-efficiency power supply
SYS-6029P-TR2U Rackmount Standard Barebone Mainstream Server12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
  • 8x 3.5" hot-swap SATA3 drive bay
Dual LAN RJ45 ports with Intel® X722 Gigabit Ethernet Controller; 1x Dedicated IPMI LAN RJ45 port2x Redundant 1000W Redundant Power Supply Titanium Level (96% typical efficiency)
SYS-6029TP-HTR2U Rackmount 438 x 88 x 774mm (17.25” x 3.47” x 30.5”)42
  • Dual Socket P (LGA 3647) 2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡, Dual UPI up to 10.4GT/s Support CPU TDP 70-165W*
Intel® C621 chipset
  • 16 DIMM slots Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM Supports Intel® Optane™ DCPMM††
  • Quad set of 3x 3.5” hot-swap SATA drive bays
Quad set of single IPMI 2.0 + KVM with dedicated LAN only. Need one network card installed per node2200W Redundant Titanium Level high-efficiency Power Supplies with I2C & PMBus
SSG-6049P-E1CR36H4U 17.2" (437mm) x 7" (178mm) x 27.5" (699mm)12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C622 chipset
  • Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
  • 36x 3.5" hot-swap SAS3/SATA3 drive bays
Dual LAN with 10GBase-T with Intel® X5571200W Titanium Level high-efficiency power supply
SYS-7039A-IMid-Tower12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz in 16 DIMM slots
  • 4x 3.5" fixed drive bay, optional 4x 2.5" fixed drive bay
Dual GbE LAN from C6211200W High-efficiency (Platinum level) PWS
SYS-7049GP-TRT4U Rackmount/Workstation 462 x 178 x 673mm (18.2" x 7.0" x 26.5")12
  • Intel Xeon Scalable Processors with UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
  • 8 Hot-swap 3.5" Drive Bays; (2x SATA3 ports default)
2 10GBase-T ports; Intel® X550 10GBase-T2200W Titanium Level efficiency redundant power supplies
SYS-7049P-TR2U Rackmount Standard Barebone Mainstream Server12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
  • 8x 3.5" hot-swap SATA3 drive bay
Dual LAN RJ45 ports with Intel® X722 Gigabit Ethernet Controller; 1x Dedicated IPMI LAN RJ45 port2x Super Quiet 1280W Redundant Power Supply modules, high-efficiency Platinum Level (94% typical efficiency ),
SYS-E100-9S-L1U Box11
  • 7th Generation Intel® Core™ i3-7100U Processor
System on Chip
  • Up to 32GB Unbuffered non-ECC SO-DIMM, DDR4-2133MHz, in 2 DIMM slots
  • N/A
Dual LAN with Intel®PHY I219LM, 1 USB3.1, 2 USB3.0, 4 USB2.0, 4 COM (RS-232/422/485), 1 DIO via DB9, TPM2.0 onboardLockable 12V DC 60W power adapter
SYS-E100-9W-L11
  • 8th Generation Intel® Core™ i3-8145UE Processor.
  • Single Socket FCBGA-1528 supported, CPU TDP support Up to 15W TDP
System on Chip chipset
  • Up to 64GB Unbuffered non-ECC SO-DIMM, DDR4-2400MHz, in 2 DIMM slots
  • N/A
Single LAN with Intel® Ethernet Controller I210IT&lt;br&gt;Single LAN with Intel® PHY I219LM LAN controllerLockable 12V DC 60W power adapter
SYS-E300-9D-8CN8TP1U Compact Box with Rackmount available11
  • Intel Skylake Xeon D-2146NT SoC, 2.3GHz, 8 Core, 80W
System On Chip
  • DDR4-2666 512GB LRDIMM or 256GB Registered ECC RDIMM in 4 DIMM slots
  • 1x 2.5" fixed drive bay with bracket. (No 2.5" fixed drive bay when AOC area is occupied.)
2 x 10G SFP+, 2 x 10GbE LAN, 4x 1GbE LAN, 1x dedicated IPMI LAN, 2 USB 3.0DC power adapter
SYS-E302-9A11
  • Intel® Atom® Processor C3558.
  • Single Socket FCBGA-1310 supported, CPU TDP support Up to 16W TDP
System on Chip chipset
  • Up to 256GB Registered ECC RDIMM, DDR4-2133MHz <br>Or 64GB Unbuffered ECC/non-ECC UDIMM, DDR4-2133MHz, in 4 DIMM slots
  • 2x 2.5" 7mm fixed drive bay
4x 1GbE, 1x dedicated IPMI LAN, 2x USB 2.0Lockable 12V DC 60W power adapter
SYS-E302-9D11
  • Intel® Xeon® Processor D-2123IT, CPU TDP support Up to 60W TDP
System on Chip chipset
  • Up to 256GB DDR4 ECC/non-ECC RDIMM
  • 2x 2.5" fixed drive bay with bracket
2x 10G SFP+, 2x 10GbE LAN, 4x 1GbE LAN, 1x dedicated IPMI LAN, 2 USB 3.0150W 12V Lockable DC Power Adapter (Optional: 180W 12V Lockable DC Power Adapter)
Motherboards
MotherboardGeneration# of CPU SocketCPU Type SupportedForm FactorChipset# of System Memory SlotsOnboard Storage ControllerExpansion SlotOnboard LANGlobal SKU
X11SDV-8C-TP8F
X11SingleIntel® Xeon® Processor D-2146NT
Flex ATXSystem on Chip4SoC controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCI-E 3.0 x8,
  • 1 PCI-E 3.0 x16
  • 1 Mini-PCI-E
  • M.2 Interface: 1 SATA/PCI-E 3.0 x4; 1 SATA/PCI-E 3.0 x2
  • Form Factor: 2280, 3042
  • M.2 Key: M-Key, B-Key
  • U.2 interface: 2 PCI-E 3.0 x4
  • Dual LAN with 10Gbase-T
    Quad LAN with Intel® Ethernet Controller I350-AM4
    Dual LAN with 10G SFP+ LAN via SoC
Global SKU
X11SPL-F
X11Single2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
ATXIntel® C6218Intel® C621 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 2 PCI-E 3.0 x8 (in x16 slot),
  • 4 PCI-E 3.0 x8,
  • 1 PCI-E 3.0 x4 (in x8 slot)
  • M.2 Interface: PCI-E 3.0 x4; SATA
  • Form Factor: 2280, 22110
  • M.2 Key: M-Key
  • Dual LAN with 1GbE with Intel® I210
Global SKU
X11SSW-F
X11SingleIntel® Celeron®, Intel® Pentium®, Intel® 7th/6th Generation Core i3 series, Intel® Xeon® processor E3-1200 v6/v5
Single Socket LGA-1151 (Socket H4) supported, CPU TDP supports Up to 80W TDP
ProprietaryIntel® C2364Intel® C236 controller for 6 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCI-E 3.0 x16 Left Riser Slot,
  • 1 PCI-E 3.0 x4 (in x16 slot)
  • M.2 Interface: PCI-E 3.0 x4; SATA
  • Form Factor: 22110, 2260, 2280
  • M.2 Key: M-Key
  • Dual LAN with Intel® Ethernet Controller I210-AT
Global SKU
X11DPL-I
X11Dual2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 140W TDP, Dual UPI up to 10.4 GT/s
ATXIntel® C6218Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 2 PCI-E 3.0 x16,
  • 3 PCI-E 3.0 x8,
  • 1 PCI-E 3.0 x4 (in x8 slot)
  • M.2 Interface: 1 SATA/PCI-E 3.0 x4
  • Form Factor: 2280, 2260
  • M.2 Key: M-Key
  • Dual LAN with 1GbE with Intel® X722 + Marvell 88E1512
Global SKU
X11DPI-N
X11Dual2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s
E-ATXIntel® C62116Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCI-E 3.0 x16,
  • 2 PCI-E 3.0 x8
  • M.2 Interface: PCI-E 3.0 x4
  • Form Factor: 22110, 2280, 2260
  • M.2 Key: M-Key
  • Dual LAN with 1GbE LAN with Intel® X722
Global SKU
X11DPI-NT
X11Dual2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s
E-ATXIntel® C62216Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCI-E 3.0 x16,
  • 2 PCI-E 3.0 x8
  • M.2 Interface: PCI-E 3.0 x4
  • Form Factor: 22110, 2280, 2260
  • M.2 Key: M-Key
  • Dual LAN with 10GBase-T with Intel® X722 + X557
Global SKU
A2SDi-8C-HLN4F
OthersSingleIntel® Atom® Processor C3758
Single Socket FCBGA-1310 supported, CPU TDP supports Up to 25W TDP
Mini-ITXSystem on Chip4SoC controller for 12 SATA3 (6 Gbps) ports
  • 1 PCI-E 3.0 x4
  • M.2 Interface: SATA; PCI-E 3.0 x2
  • Form Factor: 2280, 2242
  • M.2 Key: M-Key
  • Quad LAN with Intel® C3000 SoC, 1GbE
Global SKU
X11SPI-TF
X11Single2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP
ATXIntel® C6228Intel® C622 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCI-E 3.0 x16,
  • 1 PCI-E 3.0 x16 (x16 or x8 ),
  • 1 PCI-E 3.0 x8 (x0 or x8 ),
  • 1 PCI-E 3.0 x8,
  • 1 PCI-E 3.0 x4 (in x8 slot)
  • M.2 Interface: PCI-E 3.0 x4; SATA
  • Form Factor: 2280, 22110
  • M.2 Key: M-Key
  • Dual LAN with 10GBase-T with Intel® X722 + X557
Global SKU
X11SCL-F
X11Single8th/9th Generation Intel® Core™ i3/Pentium®/Celeron® Processor, Intel® Xeon® E-2100 Processor, Intel® Xeon® E-2200 Processor
Single Socket LGA-1151 (Socket H4) supported, CPU TDP supports Up to 95W TDP
microATXIntel® C2424Intel® C242 controller for 6 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCI-E 3.0 x8 (in x16 slot),
  • 2 PCI-E 3.0 x4 (in x8 slot)
  • M.2 Interface: 1 PCI-E 3.0 x4
  • Form Factor: 2280/22110
  • M.2 Key: M-Key
  • Dual LAN with 1GbE with Intel® I210
Global SKU
X11DAi-N
X11Dual2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s
E-ATXIntel® C62116Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCI-E 3.0 x16,
  • 2 PCI-E 3.0 x8
  • M.2 Interface: PCI-E 3.0 x4
  • Form Factor: 22110, 2280, 2260
  • M.2 Key: M-Key
  • Dual LAN with GbE from C621
Global SKU
X12SPA-TF
X12Single3rd Gen Intel® Xeon® Scalable processors, Intel® Xeon® W-3300 Processor
Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
E-ATXIntel® C621A16Intel® C621A controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCI-E 4.0 x16,
  • 3 PCI-E 4.0 x8 (in x16 slot)
  • PCI-Ex16 Slot#1 shares with M.2, Slot#2 shares with Slot#3(NA/16,8/8), Slot#4 shares with Slot#5(NA/16,8/8), Slot#6 shares with Slot#7(NA/16,8/8)
  • M.2 Interface: 4 PCI-E 4.0 x4
  • Form Factor: 2260/2280/22110
  • M.2 Key: M-Key
  • M.2 support to RAID 0,1, 5, 10, VROC key is required for RAID.
  • Single LAN with Intel® Ethernet Controller I210-AT
    Single LAN with Realtek RTL8211F PHY (dedicated IPMI)
    Single LAN with Marvell AQC113
Global SKU
X12SCV-LVDS
X12SingleIntel® Xeon® W-1200 Processors, 10th Generation Intel® Core™ i9/Core™ i7/Core™ i5/Core™ i3 Processor
Single Socket LGA-1200 (Socket H5) supported, CPU TDP supports Up to 65W TDP
Mini-ITXIntel® W480E2Intel® W480E controller for 2 SATA3 (6 Gbps) ports; RAID 0,1
  • 1 PCI-E 3.0 x16 slots (16/NA or 8/8)
  • M.2 Interface: 1 SATA/PCI-E 3.0 x4; 1 CNVi/PCI-E 3.0 x1
  • Form Factor: 2242/2280, 3042
  • M.2 Key: M-Key, E-Key
  • Single LAN with Intel® PHY I219LM LAN controller
    Single LAN with Intel® Ethernet Controller I210-AT
Global SKU
X12DPi-N6
X12Dual3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
E-ATXIntel® C621A18Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCI-E 4.0 x16,
  • 2 PCI-E 4.0 x8
  • 2 PCI-E 4.0 x8 NVMe Internal Port(s)
  • M.2 Interface: 1 PCI-E 4.0 x4
  • Form Factor: 2280/22110
  • M.2 Key: M-Key
  • Dual LAN with Intel® i350 Gigabit Ethernet Controlle
Global SKU
X12DPi-NT6
X12Dual3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
E-ATXIntel® C621A18Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCI-E 4.0 x16,
  • 2 PCI-E 4.0 x8
  • 2 PCI-E 4.0 x8 NVMe Internal Port(s)
  • M.2 Interface: 1 PCI-E 4.0 x4
  • Form Factor: 2280/22110
  • M.2 Key: M-Key
  • Dual LAN with 10GBase-T with Intel® X550
Global SKU
X12SPW-TF
X12Single3rd Gen Intel® Xeon® Scalable processors
Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
Proprietary WIOIntel® C621A8Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCI-E 4.0 x16 Right Riser Slot,
  • 1 PCI-E 4.0 x32 Left Riser Slot
  • 4 PCI-E 4.0 x4 NVMe Internal Port(s)
  • M.2 Interface: PCI-E 3.0 x4; SATA
  • Form Factor: 2280, 22110
  • M.2 Key: M-Key
  • Dual LAN with 10GBase-T with Intel® X550
Global SKU
X12SPI-TF
X12Single3rd Gen Intel® Xeon® Scalable processors
Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
ATXIntel® C621A8Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 2 PCI-E 4.0 x16,
  • 1 PCI-E 4.0 x8 (in x16 slot),
  • 2 PCI-E 4.0 x8
  • 1 PCI-E 4.0 x8 NVMe Internal Port(s)
  • M.2 Interface: 1 SATA/PCI-E 3.0 x4
  • Form Factor: 2280/22110
  • M.2 Key: M-Key
  • Dual LAN with 10GBase-T with Intel® X550
Global SKU
X12DAI-N6
X12Dual3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
E-ATXIntel® C621A16Intel® C621A controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCI-E 4.0 x8,
  • 5 PCI-E 4.0 x16
  • 4 PCI-E 4.0 x4 NVMe Internal Port(s)
  • M.2 Interface: 2 PCI-E 4.0 x4, RAID 0 & 1
  • Form Factor: 2280/22110
  • M.2 Key: M-Key
  • Dual LAN with Intel® i210 Gigabit Ethernet Controlle
Global SKU
X12DPL-i6
X12Dual3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, Dual UPI up to 11.2 GT/s
ATXIntel® C621A8Intel® C621A controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCI-E 4.0 x16
  • M.2 Interface: 1 PCI-E 4.0 x4; 1 PCI-E 4.0 x4
  • Form Factor: 2280/22110, 2280
  • M.2 Key: M-Key, M-Key
  • Dual LAN with Intel® i210 Gigabit Ethernet Controlle
Global SKU
X12DPL-NT6
X12Dual3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, Dual UPI up to 11.2 GT/s
ATXIntel® C621A8Intel® C621A controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCI-E 4.0 x16
  • 1 PCI-E 4.0 x8 NVMe Internal Port(s)
  • M.2 Interface: 1 PCI-E 4.0 x4; 1 PCI-E 4.0 x4
  • Form Factor: 2280/22110, 2280
  • M.2 Key: M-Key, M-Key
  • Dual LAN with Intel® X550 10GBase-T Ethernet Controlle
Global SKU
X12SPL-F
X12Single3rd Gen Intel® Xeon® Scalable processors
Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
ATXIntel® C621A8Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCI-E 4.0 x16,
  • 1 PCI-E 4.0 x8 (in x16 slot),
  • 2 PCI-E 4.0 x8,
  • 3 PCI-E 3.0 x8
  • M.2 Interface: 1 SATA/PCI-E 3.0 x4
  • Form Factor: 2280/22110
  • M.2 Key: M-Key
  • Dual LAN with Intel® i210 Gigabit Ethernet Controlle
Global SKU
X12SAE-5
X12Single11th Generation Intel® Core™ i5/i7/i9 Processors, Intel® Xeon® W-1300 Processors, Intel® Xeon® W-1200 Processors, 10th Generation Intel® Core™ i9/Core™ i7/Core™ i5/Core™ i3 Processor
Single Socket LGA-1200 (Socket H5) supported, CPU TDP supports Up to 125W TDP
ATXIntel® W5804Intel® W580 controller for 6 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 2 PCI-E 4.0 x16 slots (16/NA or 8/8),
  • 2 PCI-E 3.0 x1
  • 1 - 5V PCI 32bit
  • M.2 Interface: 1 PCI-E 4.0 x4, RAID 0 & 1; 2 PCI-E 3.0 x4
  • Form Factor: 2280/22110
  • M.2 Key: M-Key
  • RAID 5 only applied for INTEL Storage Device
  • Single LAN with Intel® PHY I219LM LAN controller
    Single LAN with Intel® Ethernet i225V
Global SKU
X11SCH-LN4F
X11Single8th/9th Generation Intel® Core™ i3/Pentium®/Celeron® Processor, Intel® Xeon® E-2100 Processor, Intel® Xeon® E-2200 Processor
Single Socket LGA-1151 (Socket H4) supported, CPU TDP supports Up to 95W TDP
Micro-ATXIntel® C2464Intel® C246 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCI-E 3.0 x8 (in x16 slot),
  • 1 PCI-E 3.0 x8
  • M.2 Interface: PCI-E 3.0 x4
  • Form Factor: 22110, 2280
  • M.2 Key: M-Key
  • Quad LAN with Intel® Ethernet Controller I210
Global SKU
M12SWA-TF
M12SingleAMD Ryzen™ Threadripper™ PRO 3000 Series ProcessorsE-ATXAMD WRX808AMD WRX80 controller for 4 SATA3 (6 Gbps) ports, Software RAID 0,1,5,10
  • 6 PCI-E 4.0 x16Interface: 2 U.2 Sockets Software RAID 0,1 support
  • M.2 Interface: 4 PCI-E 4.0 x4
  • M.2 Form Factor: 22110, 2260
  • M.2 Key: M-Key
  • 1 1GbE with IntelⓇ I210-AT,
  • 1 Marvell AQC113C
Global SKU
H12DSU-iNR
H12DualAMD EPYC™ 7002 series (Rome) Processors, AMD EPYC™ 7003 series (Milan) ProcessorsProprietary 17" x 17"System on Chip32AMD SP3 SATA controller
  • 1 PCI-E 4.0 x32 Left Riser Slot
  • 1 PCI-E 4.0 x16 Right Riser Slot
  • 1 PCI-E 4.0 x40 Far Right Riser Slot
  • 1 Realtek RTL8211F PHY (dedicated IPMI)
Global SKU
Chassis
SKUForm FactorPower SupplyEfficient Power SupplyDrive Bays
CSE-847BE1C4-R1K23LPB4U1000W/1200W/1200W80 Plus Titanium38
CSE-846BE1C-R1K23B4U1000W/1200W/1200W80 Plus Titanium24
CSE-826BE1C4-R1K23LPB2U1000W/1200W/1200W80 Plus Titanium14
CSE-826BE1C-R920LPB2U920W80 Plus Platinum14
CSE-825TQC-R802LPB2U800W/800W80 Plus Titanium10
CSE-815TQC-R706WB21U700W/750W80 Plus Platinum4
CSE-813MFTQC-R407CB1U400W/400W80 Plus Platinum4
CSE-813MFTQC-350CB21U350W80 Plus Platinum4
CSE-743AC-1K26B-SQ4U1000W/1200W80 Plus Platinum8
CSE-732D4-668BMid-Tower668W80 Plus Platinum8
CSE-512L-200B1U200W2
CSE-512F-350B1Mini-1U350W80 Plus Platinum2
CSE-505-203BMini-1U200W80 Plus Gold9
CSE-504-203BMini-1U200W80 Plus Gold9
CSE-216BE1C-R920LPB2U920W80 Plus Platinum26