SuperServer ARS-111GL-DNHR-LCC (Complete System Only)

1U 2-Node NVIDIA GH200 Grace Hopper Superchip system with liquid-cooling supporting NVIDIA BlueField-3 or NVIDIA ConnectX-7

ARS-111GL-DNHR-LCC Main ARS-111GL-DNHR-LCC Top ARS-111GL-DNHR-LCC Front ARS-111GL-DNHR-LCC Rear
Integrated Board: G1SMH-G
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Key Applications

  • High Performance Computing
  • AI/Deep Learning Training and Inference
  • Large Language Model (LLM) and Generative AI

Key Features

Two nodes in a 1U form factor. Each node supports the following:
  1. High density 1U 2-node GPU system with Integrated NVIDIA® H100 GPU (1 per Node)
  2. NVIDIA Grace Hopper™ Superchip (Grace CPU and H100 GPU)
  3. NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and GPU at 900GB/s
  4. Up to 576GB of coherent memory per node including 480GB LPDDR5X and 96GB of HBM3 for LLM applications
  5. 2x PCIe 5.0 x16 slots per node supporting NVIDIA BlueField®-3 or ConnectX®-7
  6. 7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
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ARS-111GL-DNHR-LCC
Specifications Resources & Downloads
Specifications
Product SKUs
ARS-111GL-DNHR-LCC
Motherboard
Super G1SMH-G
Processor (per Node)
CPU
  • NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip
Note
  • Supports up to 2000W TDP CPUs (Liquid Cooled)​
GPU (per Node)
Max GPU Count
  • Up to 1 onboard GPU(s)
Supported GPU
  • NVIDIA: H100 Tensor Core GPU on GH200 Grace Hopper™ Superchip (Liquid-cooled)
  • View GPU Options
CPU-GPU Interconnect
  • NVLink®-C2C
GPU-GPU Interconnect
  • PCIe
System Memory (per Node)
Memory
  • Slot Count: Onboard Memory
  • Max Memory: Up to 480GB ECC LPDDR5X
  • Additional GPU Memory: Up to 96GB ECC HBM3
On-Board Devices (per Node)
Chipset
  • System on Chip
Network Connectivity
Input / Output (per Node)
LAN
  • 1 RJ45 1 GbE Dedicated IPMI LAN port(s)
USB
  • 2 port(s) (rear)
Video
  • 1 mini-DP port(s)
System BIOS
BIOS Type
  • AMI 64MB SPI Flash EEPROM
Management
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 1U Rackmount
Model
  • CSE-GP102TS-R000NDFP
chassisWeight
  • Net Weight: 48.5 lbs (22 kg)
  • Gross Weight: 65.5 lbs (29.7 kg)
Dimensions and Weight
Height
  • 1.75" (44 mm)
Width
  • 17.33" (440 mm)
Depth
  • 37" (940 mm)
Package
  • 9.5" (H) x 48" (W) x 28" (D)
Weight
  • Gross Weight: 65.5 lbs (29.7 kg)
  • Net Weight: 48.5 lbs (22 kg)
Available Color
  • Silver
Expansion Slots (per Node)
PCI-Express (PCIe) Configuration
Drive Bays / Storage (per Node)
Drive Bays Configuration
  • Default: Total 4 bay(s)
    • 4 front hot-swap E1.S NVMe drive bay(s)
M.2
  • 2 M.2 NVMe slot(s) (M-key)
System Cooling
Fans
  • 7 Removable heavy-duty 4cm Fan(s)
Liquid Cooling
  • Direct to Chip (D2C) Cold Plate (optional)
Power Supply
2x 2700W Redundant Titanium Level power supplies
Dimension (WxHxL)
  • 73.5 x 40 x 185 mm
+12V
  • Max: 225A / Min: 0A (200Vac-240Vac)
  • Max: 225A / Min: 0A (240Vdc-240Vdc)
12V SB
  • Max: 4A / Min: 0A
AC Input
  • 2700W: 200-240Vac / 50-60Hz
  • 2700W: 240-240Vdc / 50-60Hz (for CQC only)
Output Type
  • Backplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources & Downloads
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