Supermicro Introduces New Versatile System Design for AI Delivering Optimization and Flexibility at the Edge
New 3U Server Supports up to 18 GPUs and Features Dual Intel® Xeon® 6900 series processors with P-cores
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Supermicro MegaDC ARS-211M-NR Review An Ampere AmpereOne Arm Server is Here
Today, we have the server review we have been waiting to do for some time. This is the Supermicro MegaDC ARS-211M-NR, an Ampere AmpereOne system.
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Supermicro Solidifies Position as a Leader in Complete Rack Scale Liquid Cooling Solutions -- Currently Shipping Over 100,000 NVIDIA GPUs Per Quarter
Designed for Data Center Scale Reduction in TCO and Enabling Large AI Clusters to Perform with a Lower Energy Budget, Liquid Cooling Solution Handles the Highest Wattage Servers Containing the Latest NVIDIA GPUs and CPUs, Resulting in Lower Costs for AI Factories – Over 2,000 Liquid Cooled Racks Delivered Since June 2024
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Super Micro in Gen AI Servers Deal With Fujitsu
Super Micro Computer announced a partnership with Japanese information-technology services provider Fujitsu to develop energy-efficient generative-artificial-intelligence servers.
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Fujitsu and Supermicro announce strategic collaboration to develop green AI computing technology and liquid-cooled datacenter solutions
Companies combine engineering and design expertise for next generation systems supporting Gen AI and HPC workloads for on-prem and cloud data centers and the promotion of green IT
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Supermicro ARS-211M-NR AmpereOne Server With R13SPD Motherboard
One of the interesting highlights of September was finally having our hands on an AmpereOne server! After years of being eager to test Ampere Computing's next-generation AArch64 server processors, Ampere sent over their 192-core flagship server processor for a few weeks of testing.
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Supermicro Adds New Max-Performance Intel-Based X14 Servers, Delivering the Industry's Broadest Range of Workload-Optimized Systems for AI, HPC, Cloud, and Edge
More than 15 Product Families of Completely Upgraded Servers Optimized for Maximum Performance or Efficiency, Featuring Next-Generation GPU Support, Higher-Bandwidth Memory, 400GbE Networking, E1.S and E3.S Drives, and Direct-to-Chip Liquid Cooling Support, and are Based on the New Intel® Xeon® 6900 Series Processors with P-Cores and Intel Xeon 6700 Series Processors with E-cores
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DCD>Talks AI data center considerations for power with Nathan Mallamace, Supermicro
Supermicro's Nathan Mallamace speaks with DCD's Kat Sullivan about power and cooling considerations for AI data centers.
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Supermicro's New Multi-Node Liquid Cooled Architecture with Maximum Performance Density Purpose-Built for HPC at Scale
The New Rack-Scale Ready FlexTwin™ Systems Deliver Unprecedented Compute-Density in a Multi-Node Form Factor, with DLC dual CPUs up to 500W Each per Node, Front Node Access and Optimized Networking
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